Chair of Functional Materials and Materials Systems (425)
Organisational unit: Chair
551 - 560 out of 685Page size: 10
Research output
- Published
Hard coatings with designed anisotropic thermal conductivity
Skalnik, K., 2017Research output: Thesis › Diploma Thesis
- Published
Copper adsorption by chemically modified pine needles
Solomi, A., Philippou, K., Kostoglou, N., Pashhalidis, I. & Rebholz, C., 2019.Research output: Contribution to conference › Poster › Research
- Published
A comprehensive study on the metallographic preparation of W-Re samples for high resolution electron-based microscopy
Sommerauer, M., Clemens, H., Maier-Kiener, V. & Siller, M., 2023, Pract. Metallograp.. Vol. 60. p. 171-186Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- E-pub ahead of print
Artificial thermal shock cracks in WRe – A proof of concept study
Sommerauer, M., Siller, M., Pippan, R., Bostrom, N. & Maier-Kiener, V., 29 May 2024, (E-pub ahead of print) In: Nuclear Materials and Energy. 39.2024, June, 8 p., 101685.Research output: Contribution to journal › Article › Research › peer-review
- Published
Enhanced thermomechanical fatigue resistance in W10Re alloys: Microstructural and surface engineering approaches
Sommerauer, M., Seligmann, B., Gottlieb, H., Hohenwarter, A., You, J.-H., Bostrom, N., Pippan, R., Siller, M. & Maier-Kiener, V., 11 Oct 2024, In: Nuclear Materials and Energy. 41.2024, December, 11 p., 101769.Research output: Contribution to journal › Article › Research › peer-review
- Published
Influence of the N2 partial pressure on structure and properties of Zr1-xAlxN thin films
Sonnleitner, D., Paulitsch, J., Polcik, P. & Mayrhofer, P. H., 2012.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Effect of growth conditions on stress, texture, roughness and self-annealing behavior of sputter deposited Cu films
Souli, I. & Mitterer, C., 2015.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers
Souli, I., Terziyska, V., Keckes, J., Zechner, J. & Mitterer, C., 2016.Research output: Contribution to conference › Presentation › Research
- Published
Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers
Souli, I., Terziyska, V., Keckes, J., Robl, W., Zechner, J. & Mitterer, C., 9 Feb 2017, In: Journal of vacuum science & technology / B (JVST). 35.2017, 2, 11 p., 022201.Research output: Contribution to journal › Article › Research › peer-review
- Published
Microstructure and physical properties of sputter-deposited Cu-Mo thin films
Souli, I., Terziyska, V., Zechner, J. & Mitterer, C., 2018, In: Thin solid films. p. 301-308Research output: Contribution to journal › Article › Research › peer-review
