Chair of Designing Plastics and Composite Materials (250)

Organisational unit: Chair

Research output

  1. 2025
  2. Published
  3. 2024
  4. Published

    Enhancement of copper nanoparticle yield in magnetron sputter inert gas condensation by applying substrate bias voltage and its influence on thin film morphology

    Knabl, F., Gutnik, D., Patil, P., Bandl, C., Vermeij, T., Pichler, C. M., Putz, B. & Mitterer, C., Dec 2024, In: Vacuum. 230, 113724.

    Research output: Contribution to journalArticleResearchpeer-review

  5. Published

    An optimization strategy for customizable global elastic deformation of unit cell-based metamaterials with variable material section discretization

    Thalhamer, A., Fleisch, M., Schuecker, C., Fuchs, P. F., Schlögl, S. & Berer, M., 12 Nov 2024, In: Advances in Engineering Software. 199.2025, January, 17 p., 103817.

    Research output: Contribution to journalArticleResearchpeer-review

  6. E-pub ahead of print

    Magnetospheric Venus Space Explorers (MVSE) mission: A proposal for understanding the dynamics of induced magnetospheres

    Albers, R., Andrews, H., Boccacci, G., Castro Pires, V. D., Laddha, S., Lundén, V., Maraqten, N., Matias, J., Krämer, E., Schulz, L., Palanca, I. T., Teubenbacher, D., Baskevitch, C., Covella, F., Cressa, L., Moreno, J. G., Gillmayr, J., Hollowood, J., Huber, K., Kutnohorsky, V., & 10 othersLennerstrand, S., Malatinszky, A., Manzini, D., Maurer, M., Nidelea, D. M. A., Rigon, L., Sinjan, J., Suarez, C., Viviano, M. & Knutsen, E. W., 19 May 2024, (E-pub ahead of print) In: Acta astronautica. 221.2024, August, p. 194-205 12 p.

    Research output: Contribution to journalArticleResearchpeer-review

  7. Published

    Evaluation of existing and introduction of new incremental crack propagation approaches in FEM

    Pletz, M., Frankl, S. M. & Schuecker, C., 3 May 2024, In: Theoretical and Applied Fracture Mechanics. 131.2024, June, 11 p., 104452.

    Research output: Contribution to journalArticleResearchpeer-review

  8. Published

    ConForce: Computation of configurational forces for FEM results

    Rettl, M., Frankl, S. M., Pletz, M., Tauscher, M. & Schuecker, C., 1 Apr 2024, In: SoftwareX. 26.2024, May, 6 p., 101718.

    Research output: Contribution to journalArticleResearchpeer-review

  9. Published

    M5 — Mars Magnetospheric Multipoint Measurement Mission: A multi-spacecraft plasma physics mission to Mars

    Larkin, C. J. K., Lundén, V., Schulz, L., Baumgartner-Steinleitner, M., Brekkum, M., Cegla, A., Dazzi, P., Iuliis, A. D., Gesch, J., Lennerstrand, S., Nesbit-Östman, S., Castro Pires, V. D., Palanca, I. T., Teubenbacher, D., Enengl, F. & Hallmann, M., 15 Mar 2024, In: Advances in Space Research. 73.2024, 6, p. 3235-3255 21 p.

    Research output: Contribution to journalArticleResearchpeer-review

  10. E-pub ahead of print

    Delamination prevention of composite joints with asymmetric carbon-fiber reinforced plastic adherends

    Castro Pires, V. D., Carbas, R. JC., Marques, E. AS. & Silva, L. FM. D., 9 Feb 2024, (E-pub ahead of print) In: Journal of composite materials. 58.2024, 8, p. 1015-1029 15 p.

    Research output: Contribution to journalArticleResearchpeer-review

  11. Published

    The reduction of stress concentrations in adhesive joints with the use of curved aluminum adherends

    Castro Pires, V. D., Ribeiro, F. C. C., Carbas, R., Marques, E. A. S. & Silva, L. F. M. D., 12 Jan 2024, In: Mechanics of advanced materials and structures. 31.2024, 28, 12 p.

    Research output: Contribution to journalArticleResearchpeer-review

  12. Published

    A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

    Kamble, V. G., Patel, D. R., Schipfer, C., Thalhamer, A., Zuendel, J., Krivec, T., Antretter, T. & Fuchs, P. F., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

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