Chair of Automation and Measurement (530)

Organisational unit: Chair

Research output

  1. Published

    Automated surface crack detection with inductive thermography

    Oswald-Tranta, B., 1 Nov 2024, In: E-Journal of nondestructive testing. 29.2024, 11, 4 p., 30301.

    Research output: Contribution to journalArticleResearchpeer-review

  2. Published

    Temperature reconstruction of infrared images with motion deblurring

    Oswald-Tranta, B., 11 Jan 2018, In: Journal of Sensors and Sensor Systems. 7.2018, 1, p. 13-20 8 p.

    Research output: Contribution to journalArticleResearchpeer-review

  3. Published

    Lock-in inductive thermography for surface crack detection in different metals

    Oswald-Tranta, B., 24 Mar 2019, In: Quantitative InfraRed Thermography Journal. 2019, March, 25 p.

    Research output: Contribution to journalArticleResearchpeer-review

  4. Published

    Comparison of different inspection techniques for fatigue cracks

    Oswald-Tranta, B., Feistkorn, S., Rössler, G. & Scherrer, M., 2020, Thermosense: Thermal Infrared Applications XLII. Oswald-Tranta, B. & Zalameda, J. N. (eds.). SPIE, The Internat. Soc. for Optical Engineering, Vol. 11409. 114090C. (Proceedings of SPIE).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  5. Published

    Detection of subsurface cracks using inductive thermography

    Oswald-Tranta, B., Tuschl, C. & Hackl, A., 2021, Thermosense: Thermal Infrared Applications XLIII. Zalameda, J. N. (ed.). SPIE, The Internat. Soc. for Optical Engineering, Vol. 11743. 117430G. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 11743).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  6. Published

    Surface scanning and path planning for non-planar 3D printing

    Pan, L., 2014

    Research output: ThesisDiploma Thesis

  7. Published

    Characterization and modeling of a typical curing material for photoresist films

    Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  8. Published
  9. Published
  10. Published