Chair of Automation and Measurement (530)
Organisational unit: Chair
411 - 420 out of 615Page size: 10
Research output
- Published
Comparison of hit/miss and ‘â versus a’ POD calculations for short surface cracks using inductive thermography
Oswald-Tranta, B., de Uralde Olavera, P. L., Gorostegui-Colinas, E. & Westphal, P., 2023Research output: Non-textual form › Web publication/site › Research
- Published
Inspection of short surface cracks by inductive thermography and by computer tomography
Oswald-Tranta, B., Hackl, A., Gorostegui-Colinas, E., Merino, A. M. & Westphal, P., 2024, Thermosense: Thermal Infrared Applications XLVI. Lopez, F., Avdelidis, N. P. & Ferrarini, G. (eds.). SPIE, 130470P. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 13047).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Nondestructive Testing Handbook: Vol. 4, Thermal and Infrared Testing (IR), 4th ed.
Oswald-Tranta, B., Nov 2024, NONDESTRUCTIVE TESTING HANDBOOK. USA, p. 443 - 455 part 8Research output: Chapter in Book/Report/Conference proceeding › Chapter › Research
- Published
Inductive Thermography – a non-destructive inspection technique
Oswald-Tranta, B., 2024, 17th Quantitative InfraRed Thermography Conference.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Automated surface crack detection with inductive thermography
Oswald-Tranta, B., 1 Nov 2024, In: E-Journal of nondestructive testing. 29.2024, 11, 4 p., 30301.Research output: Contribution to journal › Article › Research › peer-review
- Published
Surface scanning and path planning for non-planar 3D printing
Pan, L., 2014Research output: Thesis › Diploma Thesis
- Published
Characterization and modeling of a typical curing material for photoresist films
Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Research and Development of a Telemetry System for Condition Monitoring of Machines Using Sub-GHz Frequency Bands
Peterseil, P., 2019Research output: Thesis › Master's Thesis
- Published
Erstellung von steuerungstechnischen Optimierungsvorschlägen für eine großtechnische Anlage zur Produktion von endlosen mineralischen Hochleistungsfasern
Pfundtner, E., 2010Research output: Thesis › Diploma Thesis
- Published
A Positioning System for Mobile Equipment based on Ultra Wideband Radio
Plessing, L., 2021Research output: Thesis › Master's Thesis
