Learning to Drive with Deep Reinforcement Learning

Chukamphaeng, N., Pasupa, K., Antenreiter, M. & Auer, P., 21 Jan. 2021, KST 2021 - 2021 13th International Conference Knowledge and Smart Technology. Institute of Electrical and Electronics Engineers, S. 147-152 6 S. 9415770. (KST 2021 - 2021 13th International Conference Knowledge and Smart Technology).

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Measurement of WBG-based power supplies

Zhu, H., Jafari, A., MacHtinger, K., Makoschitz, M. & Matioli, E., 2023, 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe. Institute of Electrical and Electronics Engineers, (2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe).

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MEMS Based Inclinometers: Noise Characteristics and Suitable Signal Processing: Noise characteristics and suitable signal processing

Schmidt, R., O'Leary, P., Ritt, R. & Harker, M., 5 Juli 2017, I2MTC 2017 - 2017 IEEE International Instrumentation and Measurement Technology Conference, Proceedings. Institute of Electrical and Electronics Engineers, 7969830

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Modelling Periodic Measurement Data Having a Piecewise Polynomial Trend Using the Method of Variable Projection

Handler, J., Ninevski, D. & O'Leary, P., Okt. 2023, IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society. Institute of Electrical and Electronics Engineers

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Multi-physics simulation of the component attachment within embedding process

Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M. & Brizoux, M., 1 Apr. 2013, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers, S. 1-6 6 S.

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Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T. & Weber, M., 2 Dez. 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, S. 380-385 6 S. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).

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Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 Mai 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, S. 2029-2035 7 S. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

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Numerical Investigation of Collective Motion of Cathode Spots

Kharicha, A., Karimi-Sibaki, E., Ludwig, A. & Wu, M., 15 Nov. 2018, 28th International Symposium on Discharges and Electrical Insulation in Vacuum: ISDEIV. Institute of Electrical and Electronics Engineers, Band 2. S. 467-469 3 S. (International Symposium on Discharges and Elevtrical Insultaion in Vacuum, ISDEIV).

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Oscillation Damping With Input Shaping in Individual Metering Hydraulic Systems

Rath, G., Zaev, E. & Babunski, D., 1 Juni 2019, 2019 8th Mediterranean Conference on Embedded Computing, MECO 2019 - Proceedings. Stojanovic, R., Jozwiak, L., Lutovac, B. & Jurisic, D. (Hrsg.). Institute of Electrical and Electronics Engineers, 8760056. (2019 8th Mediterranean Conference on Embedded Computing, MECO 2019 - Proceedings).

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