Publikationen

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2019
Veröffentlicht
Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads
Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 Mai 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, S. 2029-2035 7 S. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Veröffentlicht
Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers
Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. & Novak, P., 5 März 2019, EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers, 8660763. (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging).
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Veröffentlicht
Deformation-induced phase transformation in a Co-Cr-W-Mo alloy studied by high-energy X-ray diffraction during in-situ compression tests
Weißensteiner, I., Petersmann, M., Erdely, P., Stark, A., Antretter, T., Clemens, H. & Maier-Kiener, V., Feb. 2019, in: Acta materialia. 164.2019, February, S. 272-282 11 S.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Veröffentlicht
A Sequential Finite Volume Method / Finite Element Analysis of a Power Electronic Semiconductor Chip
Gschwandl, M., Fuchs, P. F., Antretter, T., Pfost, M., Mitev, I., Tao, Q., Krivec, T., Schingale, A. & Decker, M., 2019, S. 1509-1514.
Publikationen: Konferenzbeitrag › Paper › (peer-reviewed)
Veröffentlicht
Cyclic heat-up and damage-relevant substrate plastification of single- and bilayer coated milling inserts evaluated numerically
Nemetz, A., Daves, W., Klünsner, T., Ecker, W., Schäfer, J., Czettl, C. & Antretter, T., 2019, in: Surface & coatings technology. 360.2019, February, S. 39-49 11 S.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Veröffentlicht
Residual stress and microstructure evolution in steel tubes for different cooling conditions – Simulation and verification
Brunbauer, S., Winter, G., Antretter, T., Staron, P. & Ecker, W., 2019, in: Materials science and engineering: A, Structural materials: properties, microstructure and processing. 747, S. 73-79
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Veröffentlicht
Shot peening-induced plastic deformation of individual phases within a coated WC-Co hard metal composite material including WC plastification
Faksa, L., Daves, W., Klünsner, T., Maier, K., Antretter, T., Czettl, C. & Ecker, W., 2019, in: Surface & coatings technology. 380.2019, 25 December, 11 S., 125026.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Veröffentlicht
Simulation of Phase Transformation and Material Plasticity for Press Hardening
Tomasch, M., Ecker, W. & Antretter, T., 2019, Proceedings of NUMIFORM 2019: the 13th International Conference on Numerical Methods in Industrial Forming Processes. S. 362-365
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
2018
Veröffentlicht
Crack arrest in thin metallic film stacks due to material- and residual stress inhomogeneities
Kozic, D., Gänser, H-P., Brunner, R., Kiener, D., Antretter, T. & Kolednik, O., 31 Dez. 2018, in: Thin solid films. S. 14-22 9 S.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Veröffentlicht
Influence of environmental factors like temperature and humidity on MEMS packaging materials.
Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A. & Qi, T., 26 Nov. 2018, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 8546484
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

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Forschungsportal

Publikationen

Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

Deformation-induced phase transformation in a Co-Cr-W-Mo alloy studied by high-energy X-ray diffraction during in-situ compression tests

A Sequential Finite Volume Method / Finite Element Analysis of a Power Electronic Semiconductor Chip

Cyclic heat-up and damage-relevant substrate plastification of single- and bilayer coated milling inserts evaluated numerically

Residual stress and microstructure evolution in steel tubes for different cooling conditions – Simulation and verification

Shot peening-induced plastic deformation of individual phases within a coated WC-Co hard metal composite material including WC plastification

Simulation of Phase Transformation and Material Plasticity for Press Hardening

Crack arrest in thin metallic film stacks due to material- and residual stress inhomogeneities

Influence of environmental factors like temperature and humidity on MEMS packaging materials.

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