Thomas Antretter
191 - 200 von 236Seitengröße: 10
Publikationen
- Veröffentlicht
An inverse finite element approach to calculate full-field forming strains
Ritt, R., Machado, M., Fischlschweiger, M., Major, Z. & Antretter, T., Juli 2015, Key engineering materials. Band 651-653.2015. S. 363-368 6 S. (Key engineering materials).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Buch/Sammelband › Forschung
- Veröffentlicht
Modelling of phase transformations and residual stress formation in hot-work tool steel components
Schemmel, M., Prevedel, P., Schöngrundner, R., Ecker, W. & Antretter, T., 2014, European Conference of Heat Treatment and 21st IFHTSE Congress. S. 285-292Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Prediction and Characterization of Residual Stresses after Heat Treatment of Massive Hot Work Tool Steel Components
Schemmel, M., Antretter, T., Ecker, W. & Prevedel, P., 19 Apr. 2017.Publikationen: Konferenzbeitrag › Vortrag › Forschung › (peer-reviewed)
- Veröffentlicht
Size effects in residual stress formation during quenching of cylinders made of hot-work tool steel
Schemmel, M., Prevedel, P., Schöngrundner, R., Ecker, W. & Antretter, T., 2015, in: Advances in Materials Science and Engineering. 7 S., 678056.Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
- Veröffentlicht
Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr. 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., Dez. 2022, in: Microelectronics Reliability. 139.2022, December, 9 S., 114799.Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
- Veröffentlicht
Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method
Schöngrundner, R., Treml, R., Antretter, T., Kozic, D., Ecker, W. & Kiener, D., 2014, in: Thin solid films. S. 321-330Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
- Veröffentlicht
Simulation of the mechanical response of the individual intermetallic phases in multi-phase γ titanium aluminides
Seligmann, B., Spörk-Erdely, P. & Antretter, T., 2023.Publikationen: Konferenzbeitrag › Poster › Forschung
- Veröffentlicht
Finite Element Investigation of the Dynamic Behavior of High-Speed Turnouts with Swing-Nose Crossing
Sistaninia, M., Daves, W., Bucher, C., Antretter, T. & Gänser, H. P., 2025, Advances in Dynamics of Vehicles on Roads and Tracks III - Proceedings of the 28th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2023, Rail Vehicles. Huang, W. & Ahmadian, M. (Hrsg.). S. 1047-1058 12 S. (Lecture Notes in Mechanical Engineering).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Effect of back stress evolution due to martensitic transformation on iso-volume fraction lines in a Cr-Ni-Mo-Al-Ti maraging steel
Tanaka, K., Terasaki, T., Goto, S., Antretter, T., Fischer, F. D. & Cailletaud, G., 20 Jan. 2003, in: Materials science and engineering: A, Structural materials: properties, microstructure and processing. 341, 1-2, S. 189-196 8 S.Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
