Thomas Antretter

Publikationen

  1. Veröffentlicht

    An inverse finite element approach to calculate full-field forming strains

    Ritt, R., Machado, M., Fischlschweiger, M., Major, Z. & Antretter, T., Juli 2015, Key engineering materials. Band 651-653.2015. S. 363-368 6 S. (Key engineering materials).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Buch/SammelbandForschung

  2. Veröffentlicht

    Modelling of phase transformations and residual stress formation in hot-work tool steel components

    Schemmel, M., Prevedel, P., Schöngrundner, R., Ecker, W. & Antretter, T., 2014, European Conference of Heat Treatment and 21st IFHTSE Congress. S. 285-292

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  3. Veröffentlicht

    Prediction and Characterization of Residual Stresses after Heat Treatment of Massive Hot Work Tool Steel Components

    Schemmel, M., Antretter, T., Ecker, W. & Prevedel, P., 19 Apr. 2017.

    Publikationen: KonferenzbeitragVortragForschung(peer-reviewed)

  4. Veröffentlicht

    Size effects in residual stress formation during quenching of cylinders made of hot-work tool steel

    Schemmel, M., Prevedel, P., Schöngrundner, R., Ecker, W. & Antretter, T., 2015, in: Advances in Materials Science and Engineering. 7 S., 678056.

    Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

  5. Veröffentlicht

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr. 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  6. Veröffentlicht

    Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., Dez. 2022, in: Microelectronics Reliability. 139.2022, December, 9 S., 114799.

    Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

  7. Veröffentlicht

    Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method

    Schöngrundner, R., Treml, R., Antretter, T., Kozic, D., Ecker, W. & Kiener, D., 2014, in: Thin solid films. S. 321-330

    Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

  8. Veröffentlicht
  9. Veröffentlicht

    Finite Element Investigation of the Dynamic Behavior of High-Speed Turnouts with Swing-Nose Crossing

    Sistaninia, M., Daves, W., Bucher, C., Antretter, T. & Gänser, H. P., 2025, Advances in Dynamics of Vehicles on Roads and Tracks III - Proceedings of the 28th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2023, Rail Vehicles. Huang, W. & Ahmadian, M. (Hrsg.). S. 1047-1058 12 S. (Lecture Notes in Mechanical Engineering).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  10. Veröffentlicht

    Effect of back stress evolution due to martensitic transformation on iso-volume fraction lines in a Cr-Ni-Mo-Al-Ti maraging steel

    Tanaka, K., Terasaki, T., Goto, S., Antretter, T., Fischer, F. D. & Cailletaud, G., 20 Jan. 2003, in: Materials science and engineering: A, Structural materials: properties, microstructure and processing. 341, 1-2, S. 189-196 8 S.

    Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)