Institute of Electrical and Electronics Engineers

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Research output

  1. Published

    Automatic Synthesis of Admissible Functions for Variational Learning

    O'Leary, P., Ninevski, D. & Terbuch, A., 2023, 2023 IEEE International Conference on Computational Intelligence and Virtual Environments for Measurement Systems and Applications (CIVEMSA 2023). Institute of Electrical and Electronics Engineers

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  2. Published

    A Flexible CAEX Based Model for Standard Integration in Tunnelling

    Paskaleva, G., Mazak-Huemer, A., Waldhart, J. & Ehrbar, H., 2021, 2021 ETFA – IEEE 26th International Conference on Emerging Technologies and Factory Automation. Institute of Electrical and Electronics Engineers, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  3. Published

    Characterization and modeling of a typical curing material for photoresist films

    Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  4. Published

    Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics

    Peng, C., Tao, Q., Krivec, T., Casas, G., Latorre, S., Antretter, T., Macher, J. & Fuchs, P., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  5. The influence of surface modification on the electrical properties of silicon carbide flakes

    Pleşa, I., Schlögl, S., Radl, S. V., Mühlbacher, I. & Schichler, U., 24 Jun 2015, 2015 9th International Symposium on Advanced Topics in Electrical Engineering, ATEE 2015. Institute of Electrical and Electronics Engineers, p. 460-463 4 p. 7133858. (2015 9th International Symposium on Advanced Topics in Electrical Engineering, ATEE 2015).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  6. Published

    Oscillation Damping With Input Shaping in Individual Metering Hydraulic Systems

    Rath, G., Zaev, E. & Babunski, D., 1 Jun 2019, 2019 8th Mediterranean Conference on Embedded Computing, MECO 2019 - Proceedings. Stojanovic, R., Jozwiak, L., Lutovac, B. & Jurisic, D. (eds.). Institute of Electrical and Electronics Engineers, 8760056. (2019 8th Mediterranean Conference on Embedded Computing, MECO 2019 - Proceedings).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  7. Published

    Improved Predictive Model for Surge/Swab Pressure Estimation using a New Simplified (NS) Model

    Ridha, S., Khanbesh, S., Arain, A. H., Yusuf, M. & Krishna, S., 2023, 2023 International Conference on Digital Business and Technology Management, ICONDBTM 2023. Institute of Electrical and Electronics Engineers, (2023 International Conference on Digital Business and Technology Management, ICONDBTM 2023).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  8. Published

    Simultaneous approximation of measurement values and derivative data using discrete orthogonal polynomials

    Ritt, R., Harker, M. & O'Leary, P., 1 May 2019, Proceedings - 2019 IEEE International Conference on Industrial Cyber Physical Systems, ICPS 2019. Institute of Electrical and Electronics Engineers, p. 282-289 8 p. 8780356. (Proceedings - 2019 IEEE International Conference on Industrial Cyber Physical Systems, ICPS 2019).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  9. Published

    A probabilistic approach for complete coverage path planning with low-cost systems

    Rottmann, N., Denz, R., Bruder, R. & Rueckert, E., Aug 2021, 2021 10th European Conference on Mobile Robots, ECMR 2021 - Proceedings. Institute of Electrical and Electronics Engineers, (2021 10th European Conference on Mobile Robots, ECMR 2021 - Proceedings).

    Research output: Chapter in Book/Report/Conference proceeding › Chapter › Research

  10. Published

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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