Research output

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  1. 2019
  2. Published

    Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

    Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, p. 2029-2035 7 p. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  3. Published

    Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

    Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. & Novak, P., 5 Mar 2019, EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers, 8660763. (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  4. Published

    Deformation-induced phase transformation in a Co-Cr-W-Mo alloy studied by high-energy X-ray diffraction during in-situ compression tests

    Weißensteiner, I., Petersmann, M., Erdely, P., Stark, A., Antretter, T., Clemens, H. & Maier-Kiener, V., Feb 2019, In: Acta materialia. 164.2019, February, p. 272-282 11 p.

    Research output: Contribution to journal › Article › Research › peer-review

  5. Published

    A Sequential Finite Volume Method / Finite Element Analysis of a Power Electronic Semiconductor Chip

    Gschwandl, M., Fuchs, P. F., Antretter, T., Pfost, M., Mitev, I., Tao, Q., Krivec, T., Schingale, A. & Decker, M., 2019, p. 1509-1514.

    Research output: Contribution to conference › Paper › peer-review

  6. Published

    Cyclic heat-up and damage-relevant substrate plastification of single- and bilayer coated milling inserts evaluated numerically

    Nemetz, A., Daves, W., Klünsner, T., Ecker, W., Schäfer, J., Czettl, C. & Antretter, T., 2019, In: Surface & coatings technology. 360.2019, February, p. 39-49 11 p.

    Research output: Contribution to journal › Article › Research › peer-review

  7. Published

    Residual stress and microstructure evolution in steel tubes for different cooling conditions – Simulation and verification

    Brunbauer, S., Winter, G., Antretter, T., Staron, P. & Ecker, W., 2019, In: Materials science and engineering: A, Structural materials: properties, microstructure and processing. 747, p. 73-79

    Research output: Contribution to journal › Article › Research › peer-review

  8. Published

    Shot peening-induced plastic deformation of individual phases within a coated WC-Co hard metal composite material including WC plastification

    Faksa, L., Daves, W., Klünsner, T., Maier, K., Antretter, T., Czettl, C. & Ecker, W., 2019, In: Surface & coatings technology. 380.2019, 25 December, 11 p., 125026.

    Research output: Contribution to journal › Article › Research › peer-review

  9. Published

    Simulation of Phase Transformation and Material Plasticity for Press Hardening

    Tomasch, M., Ecker, W. & Antretter, T., 2019, Proceedings of NUMIFORM 2019: the 13th International Conference on Numerical Methods in Industrial Forming Processes. p. 362-365

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  10. 2018
  11. Published

    Crack arrest in thin metallic film stacks due to material- and residual stress inhomogeneities

    Kozic, D., Gänser, H-P., Brunner, R., Kiener, D., Antretter, T. & Kolednik, O., 31 Dec 2018, In: Thin solid films. p. 14-22 9 p.

    Research output: Contribution to journal › Article › Research › peer-review

  12. Published

    Influence of environmental factors like temperature and humidity on MEMS packaging materials.

    Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A. & Qi, T., 26 Nov 2018, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 8546484

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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