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  1. Published

    Finite Element Modeling of the Humidity-driven Wetting Mechanism of Wheat Awns

    Zickler, G., Dunlop, J. W. C., Ruffoni, D., Elbaum, R., Weinkamer, R., Fratzl, P. & Antretter, T., 2012.

    Research output: Contribution to conference › Poster › Research › peer-review

  2. Published

    Finite Element Modeling of the Cyclic Wetting Mechanism in the Active Part of Wheat Awns

    Zickler, G., Ruffoni, D., Dunlop, J. W. C., Elbaum, R., Weinkamer, R., Fratzl, P. & Antretter, T., 2012, In: Biointerphases. 7, p. 42-42

    Research output: Contribution to journal › Article › Research › peer-review

  3. Published

    Finite Element Modeling of the Humidity-driven Wetting Mechanism of Wheat Awns

    Zickler, G., Dunlop, J. W. C., Ruffoni, D., Elbaum, R., Weinkamer, R., Fratzl, P. & Antretter, T., 2012, Proceedings of the 8th European Solid Mechanics Conference. p. 1-2

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  4. Published

    The study of controlled cooling technology and warping of X65 heavy pipeline plate

    Zhang, D. F., Lu, J. S., Antretter, T., Lü, J. G. & Song, P., 1 Dec 2011, In: Beijing Gongye Daxue Xuebao/Journal of Beijing University of Technology. 37, 12, p. 1886-1891 6 p.

    Research output: Contribution to journal › Article › Research › peer-review

  5. Published

    The role of phase interface energy in martensitic transformation: A lattice Monte-Carlo simulation

    Yastrebov, V. A., Fischlschweiger, M., Cailletaud, G. & Antretter, T., Mar 2014, In: Mechanics Research Communications. 56, p. 37-41

    Research output: Contribution to journal › Article › Research › peer-review

  6. Published

    Influence of environmental factors like temperature and humidity on MEMS packaging materials.

    Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A. & Qi, T., 26 Nov 2018, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 8546484

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  7. Published

    Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

    Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, p. 2029-2035 7 p. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  8. Published

    Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

    Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T. & Weber, M., 2 Dec 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, p. 380-385 6 p. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  9. Published

    Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fibre Reinforced Epoxy Laminates

    Yalagach, M., Fuchs, P., Antretter, T., Feuchter, M., Tao, Q. & Weber, M., 29 Jan 2021, In: Sensors & transducers. 248.2021, 1, 9 p.

    Research output: Contribution to journal › Article › Research › peer-review

  10. Published

    MUL 4.0 – Digitalisierung der Wertschöpfungskette vom Rohmaterial bis hin zum Recycling

    Woschank, M., Ralph, B. J., Kaiblinger, A., Miklautsch, P., Pacher, C., Sorger, M., Zsifkovits, H., Stockinger, M., Pogatscher, S., Antretter, T. & Antrekowitsch, H., 2 Jun 2021, In: Berg- und hüttenmännische Monatshefte : BHM. 166, 6, p. 309-313

    Research output: Contribution to journal › Article › Research › peer-review

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