Research output

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  1. 2014
  2. Published

    Characterization and modeling of the AuSnCu thin solder joint under thermal cycling

    Antretter, T., Otremba, R., Karunamurthy, B. & Pélisset, T., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  3. Published

    Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method

    Schöngrundner, R., Treml, R., Antretter, T., Kozic, D., Ecker, W. & Kiener, D., 2014, In: Thin solid films. p. 321-330

    Research output: Contribution to journal › Article › Research › peer-review

  4. Published

    Deformation mechanisms in single crystalline Mg studied by in-situ microcompression testing

    Alfreider, M., Treml, R., Jeong, J., Oh, S. H. & Kiener, D., 2014.

    Research output: Contribution to conference › Poster › Research › peer-review

  5. Published

    Deformation mechanisms in single crystalline Mg studied by in-situ microcompression testing

    Alfreider, M., Treml, R., Jeong, J., Oh, S. H. & Kiener, D., 2014.

    Research output: Contribution to conference › Poster › Research › peer-review

  6. Published

    Determination of cyclic mechanical properties of thin copper layers for PCB applications

    Fellner, K., Fuchs, P. F., Antretter, T., Pinter, G. & Schöngrundner, R., 2014, Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. p. 1-8

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  7. Published

    Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method

    Kozic, D., Treml, R., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T. & Gänser, H-P., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. Zhang, G. Q., Van Driel, W. D., Rodgers, P., Bailey, C. & de Saint Leger, O. (eds.). Institute of Electrical and Electronics Engineers, 6813785

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  8. Published

    Festigkeitsskalierung nach Weibull

    Pittino, G., Tichy, R., Galler, R., Antretter, T., Ecker, W., Gimpel, M. & Kargl, H., 2014.

    Research output: Contribution to conference › Poster › Research › peer-review

  9. Published

    Final report PN 6019

    Maier, V. & Kiener, D., 2014

    Research output: Book/Report › Commissioned report › Transfer › peer-review

  10. Published

    Influence of metastable retained austenite on macro and micromechanical properties of steel processed by the Q&P process

    Jirková, H., Masek, B., Wagner, M. F-X., Langmajerová, D., Kucerová, L., Treml, R. & Kiener, D., 2014, In: Journal of alloys and compounds. 615, p. S163-S168

    Research output: Contribution to journal › Article › Research › peer-review

  11. Published

    Leobener Materialphysiker in “Nature Communications”: BMH-online

    Kiener, D., 2014

    Research output: Non-textual form › Web publication/site › Transfer

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