Research output

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2014
Published
Characterization and modeling of the AuSnCu thin solder joint under thermal cycling
Antretter, T., Otremba, R., Karunamurthy, B. & Pélisset, T., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Published
Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method
Schöngrundner, R., Treml, R., Antretter, T., Kozic, D., Ecker, W. & Kiener, D., 2014, In: Thin solid films. p. 321-330
Research output: Contribution to journal › Article › Research › peer-review
Published
Determination of cyclic mechanical properties of thin copper layers for PCB applications
Fellner, K., Fuchs, P. F., Antretter, T., Pinter, G. & Schöngrundner, R., 2014, Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. p. 1-8
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Published
Determination of strength and fracture toughness of small ceramic discs using the small punch test and the ball-on-three-balls test
Rasche, S., Strobl, S., Kuna, M., Bermejo Moratinos, R. & Lube, T., 2014, In: Procedia Materials Science. p. 961-966
Research output: Contribution to journal › Article › Research › peer-review
Published
Effect of residuel stresses on the strength of glass-ceramic multilayer composites different microstructures
Bermejo Moratinos, R., Krautgasser, C., Deluca, M., Strobl, S., Kraleva, I., Petschenig, I., Aldrian, F., Supancic, P. & Danzer, R., 2014, Praktische Metallographie Sonderband. p. 169-174
Research output: Chapter in Book/Report/Conference proceeding › Chapter › Research
Published
Evaluation of a 5-phase mixed columnar-equiaxed solidification model with a benchmark solidification experiment of NH4Cl-H2O solution
Ahmadein, M., Wu, M., Stefan Kharicha, M., Kharicha, A. & Ludwig, A., 2014, Materials Science Forum. Vol. 790-791.2013. p. 247-252 6 p. (Materials Science Forum).
Research output: Chapter in Book/Report/Conference proceeding › Chapter › Research
Published
Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method
Kozic, D., Treml, R., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T. & Gänser, H-P., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. Zhang, G. Q., Van Driel, W. D., Rodgers, P., Bailey, C. & de Saint Leger, O. (eds.). Institute of Electrical and Electronics Engineers, 6813785
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Published
Festigkeitsskalierung nach Weibull
Pittino, G., Tichy, R., Galler, R., Antretter, T., Ecker, W., Gimpel, M. & Kargl, H., 2014.
Research output: Contribution to conference › Poster › Research › peer-review
Published
Improved Fracture Behavior of Alumina Microstructural Composites with Highly Textured Compressive Layers
Chang, Y., Bermejo Moratinos, R. & Messing, G. L., 2014, In: Journal of the American Ceramic Society. 97, p. 3643-3651
Research output: Contribution to journal › Article › Research › peer-review
Published
Influence of crystal morphological parameters on the solidification of ESR ingot
Karimi Sibaki, E., Kharicha, A., Korp, J., Wu, M. & Ludwig, A., 2014, Materials Science Forum. Vol. 790-791.2014. p. 396-401 (Materials Science Forum).
Research output: Chapter in Book/Report/Conference proceeding › Chapter › Research

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Research Portal

Research output

Characterization and modeling of the AuSnCu thin solder joint under thermal cycling

Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method

Determination of cyclic mechanical properties of thin copper layers for PCB applications

Determination of strength and fracture toughness of small ceramic discs using the small punch test and the ball-on-three-balls test

Effect of residuel stresses on the strength of glass-ceramic multilayer composites different microstructures

Evaluation of a 5-phase mixed columnar-equiaxed solidification model with a benchmark solidification experiment of NH4Cl-H2O solution

Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method

Festigkeitsskalierung nach Weibull

Improved Fracture Behavior of Alumina Microstructural Composites with Highly Textured Compressive Layers

Influence of crystal morphological parameters on the solidification of ESR ingot

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