Research output

  1. 2014
  2. Published

    Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process

    Macurova, K., Bermejo Moratinos, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Jan 2014, Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. p. 355-360 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  3. Published
  4. Published

    Atomic Force Microscopy as a Tool to Explore Triboelectrostatic Phenomena in Mineral Processing

    Mirkowska, M., Kratzer, M., Teichert, C. & Flachberger, H., 2014, In: Chemie-Ingenieur-Technik. 86, p. 857-864

    Research output: Contribution to journalArticleResearchpeer-review

  5. Published
  6. Published

    Beweissicherung des Auflockerungsfaktors

    Öfner, W. & Flachberger, H., 2014

    Research output: Book/ReportCommissioned reportTransferpeer-review

  7. Published

    Beweissicherung des Feinkornanfalls

    Öfner, W. & Flachberger, H., 2014

    Research output: Book/ReportCommissioned reportTransferpeer-review

  8. Published
  9. Published

    Characterization and modeling of the AuSnCu thin solder joint under thermal cycling

    Pélisset, T., Karunamurthy, B., Otremba, R. & Antretter, T., 2014.

    Research output: Contribution to conferencePosterResearchpeer-review

  10. Published

    Characterization and modeling of the AuSnCu thin solder joint under thermal cycling

    Antretter, T., Otremba, R., Karunamurthy, B. & Pélisset, T., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  11. Published

    Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method

    Schöngrundner, R., Treml, R., Antretter, T., Kozic, D., Ecker, W. & Kiener, D., 2014, In: Thin solid films. p. 321-330

    Research output: Contribution to journalArticleResearchpeer-review