Research output

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  1. 2014
  2. Published

    Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method

    Kozic, D., Treml, R., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T. & Gänser, H-P., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. Zhang, G. Q., Van Driel, W. D., Rodgers, P., Bailey, C. & de Saint Leger, O. (eds.). Institute of Electrical and Electronics Engineers, 6813785

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  3. Published

    Festigkeitsskalierung nach Weibull

    Pittino, G., Tichy, R., Galler, R., Antretter, T., Ecker, W., Gimpel, M. & Kargl, H., 2014.

    Research output: Contribution to conference › Poster › Research › peer-review

  4. Published

    Method development for the cyclic characterization of thin copper layers for PCB applications

    Fellner, K., Fuchs, P. F., Pinter, G., Antretter, T. & Krivec, T., 2014, In: Circuit World. 40, p. 53-60

    Research output: Contribution to journal › Article › Research › peer-review

  5. Published

    Microwave absorption and its thermo-mechanical consequences in heterogeneous rocks

    Toifl, M., Meisels, R., Hartlieb, P., Kuchar, F. & Antretter, T., 2014, Geomechanics from Micro to Macro. p. 1545-1550

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  6. Published

    Microwave absorption and its thermo-mechanical consequences in heterogeneous rocks

    Toifl, M., Meisels, R., Hartlieb, P., Kuchar, F. & Antretter, T., 2014.

    Research output: Contribution to conference › Poster › Research › peer-review

  7. Published

    Modelling of phase transformations and residual stress formation in hot-work tool steel components

    Schemmel, M., Prevedel, P., Schöngrundner, R., Ecker, W. & Antretter, T., 2014, European Conference of Heat Treatment and 21st IFHTSE Congress. p. 285-292

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  8. Published

    Residual Stress Investigations in Thin Film Systems: Experiment and Simulation

    Kozic, D., Treml, R., Sartory, B., Schöngrundner, R., Kiener, D., Antretter, T., Gänser, H-P. & Brunner, R., 2014.

    Research output: Contribution to conference › Poster › Research › peer-review

  9. Published

    Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards

    Macurova, K., Angerer, P., Antretter, T., Bermejo Moratinos, R., Maia, W., Schöngrundner, R., Krivec, T., Morianz, M. & Brizoux, M., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  10. Published

    Simulation of the roller straightening process with respect to residual stresses and the curvature trend

    Kaiser, R., Hatzenbichler, T., Buchmayr, B. & Antretter, T., 2014, International Conference on Residual Stresses 9 (ICRS 9). p. 456-463

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  11. 2013
  12. Published

    Multi-physics simulation of the component attachment within embedding process

    Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M. & Brizoux, M., 1 Apr 2013, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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