Research output

61 - 65 out of 65Page size: 10
rss feed
  1. 2011
  2. Published

    Numerical investigation of the process of embedding components into printed circuit boards

    Pletz, M., Bermejo, R., Supancic, P., Stahr, J. & Morianz, M., 2011, 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. 5765814

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  3. Published

    Strength and fracture analysis of silicon-based components for embedding

    Deluca, M., Bermejo Moratinos, R., Pletz, M., Supancic, P. & Danzer, R., 2011, In: Journal of the European Ceramic Society. 31, p. 549-558

    Research output: Contribution to journal › Article › Research › peer-review

  4. 2010
  5. Published

    Characterisation and modelling of the mechanical reliability of semiconductor components for Printed Circuit Boards

    Bermejo Moratinos, R., Deluca, M., pletz, M., Supancic, P. & Danzer, R., 2010.

    Research output: Contribution to conference › Poster › Research › peer-review

  6. Published

    Strength and fracture analysis of silicon chips to be embedded into printed circuit boards

    Deluca, M., Bermejo, R., Pletz, M. & Supancic, P., 2010, 18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  7. Published

    Theoretische Untersuchung der Einbettung von keramischen Komponenten in Leiterplatten

    Pletz, M., 2010

    Research output: Thesis › Master's Thesis

Previous 1...3 4 5 6 7 Next

Advanced filters

All authors

Reset

to
Reset filters