This work was carried out to determine the crucial steps in the integration of ceramic components into multi-layer printed circuit boards (PCBs) in terms of mechanical stresses in the components. In order to find the key parameters, the process steps were calculated using simple analytical and numerical models. The process steps of laminating (hot pressing) and cooling were investigated. During lamination of the PCB, the components are bended due to pressure created by resin flow over the component. This causes tensile stresses that can lead to fracture of the components. The critical stresses can be decreased by a constraint of the bending. The stiffness of the glue (that fixes the component during pressing) is the most important parameter for that constraint. The cooling of the printed circuit board is probably more important for the loading of the component than the laminating. The coefficients of thermal expansion are the crucial constants. The highest tensile stresses occur at the bottom edge of the components. The radius of the edge has a big influence on the stresses. With larger radii the load is reduced. With an asymmetrical geometry of the laminate, unwanted bending of the printed circuit board occurs. This effect can be influenced drastically by the buildup of the printed circuit boards.