Strength and fracture analysis of silicon chips to be embedded into printed circuit boards

Research output: Chapter in Book/Report/Conference proceedingConference contribution

External Organisational units

  • Materials Center Leoben Forschungs GmbH

Details

Original languageEnglish
Title of host publication18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale
Publication statusPublished - 2010
Event18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale, ECF 2010 - Dresden, Germany
Duration: 30 Aug 20103 Sept 2010

Conference

Conference18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale, ECF 2010
Country/TerritoryGermany
CityDresden
Period30/08/103/09/10