Characterisation and modelling of the mechanical reliability of semiconductor components for Printed Circuit Boards
Research output: Contribution to conference › Poster › Research › peer-review
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Details
| Translated title of the contribution | Characterisation and modelling of the mechanical reliability of semiconductor components for Printed Circuit Boards |
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| Original language | English |
| Publication status | Published - 2010 |
| Event | Electroceramics XII - Trondheim, Norway Duration: 13 Jun 2010 → 16 Jun 2010 |
Conference
| Conference | Electroceramics XII |
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| Country/Territory | Norway |
| City | Trondheim |
| Period | 13/06/10 → 16/06/10 |
