Characterisation and modelling of the mechanical reliability of semiconductor components for Printed Circuit Boards

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Characterisation and modelling of the mechanical reliability of semiconductor components for Printed Circuit Boards. / Bermejo Moratinos, Raul; Deluca, Marco; pletz, martin et al.
2010. Poster session presented at Electroceramics XII, Trondheim, Norway.

Research output: Contribution to conferencePosterResearchpeer-review

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@conference{0f170016d9874e0ea59d67cde9031d74,
title = "Characterisation and modelling of the mechanical reliability of semiconductor components for Printed Circuit Boards",
author = "{Bermejo Moratinos}, Raul and Marco Deluca and martin pletz and Peter Supancic and Robert Danzer",
year = "2010",
language = "English",
note = "Electroceramics XII ; Conference date: 13-06-2010 Through 16-06-2010",

}

RIS (suitable for import to EndNote) - Download

TY - CONF

T1 - Characterisation and modelling of the mechanical reliability of semiconductor components for Printed Circuit Boards

AU - Bermejo Moratinos, Raul

AU - Deluca, Marco

AU - pletz, martin

AU - Supancic, Peter

AU - Danzer, Robert

PY - 2010

Y1 - 2010

M3 - Poster

T2 - Electroceramics XII

Y2 - 13 June 2010 through 16 June 2010

ER -