Method development for the cyclic characterization of thin copper layers for PCB applications

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Method development for the cyclic characterization of thin copper layers for PCB applications. / Fellner, Klaus; Fuchs, Peter Filipp; Pinter, Gerald et al.
In: Circuit World, Vol. 40, 2014, p. 53-60.

Research output: Contribution to journalArticleResearchpeer-review

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@article{d9f1d3ad53014b62886eadb9cd102324,
title = "Method development for the cyclic characterization of thin copper layers for PCB applications",
author = "Klaus Fellner and Fuchs, {Peter Filipp} and Gerald Pinter and Thomas Antretter and Thomas Krivec",
year = "2014",
doi = "10.1108/CW-09-2013-0032",
language = "English",
volume = "40",
pages = "53--60",
journal = "Circuit World",
issn = "0305-6120",
publisher = "Emerald Group Publishing Ltd.",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Method development for the cyclic characterization of thin copper layers for PCB applications

AU - Fellner, Klaus

AU - Fuchs, Peter Filipp

AU - Pinter, Gerald

AU - Antretter, Thomas

AU - Krivec, Thomas

PY - 2014

Y1 - 2014

U2 - 10.1108/CW-09-2013-0032

DO - 10.1108/CW-09-2013-0032

M3 - Article

VL - 40

SP - 53

EP - 60

JO - Circuit World

JF - Circuit World

SN - 0305-6120

ER -