Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments
Research output: Contribution to journal › Article › Research › peer-review
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| Original language | English |
|---|---|
| Pages (from-to) | 17-22 |
| Number of pages | 6 |
| Journal | Journal of Microelectronics and Electronic Packaging |
| Volume | 13 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 2016 |
