Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments
Research output: Contribution to journal › Article › Research › peer-review
Standard
Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments. / Bermejo, Raul; Krautgasser, Clemens; Deluca, Marco et al.
In: Journal of Microelectronics and Electronic Packaging, Vol. 13, No. 1, 2016, p. 17-22.
In: Journal of Microelectronics and Electronic Packaging, Vol. 13, No. 1, 2016, p. 17-22.
Research output: Contribution to journal › Article › Research › peer-review
Harvard
Bermejo, R, Krautgasser, C, Deluca, M, Pletz, M, Supancic, P, Aldrian, F & Danzer, R 2016, 'Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments', Journal of Microelectronics and Electronic Packaging, vol. 13, no. 1, pp. 17-22. https://doi.org/10.4071/imaps.491
APA
Bermejo, R., Krautgasser, C., Deluca, M., Pletz, M., Supancic, P., Aldrian, F., & Danzer, R. (2016). Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments. Journal of Microelectronics and Electronic Packaging, 13(1), 17-22. https://doi.org/10.4071/imaps.491
Vancouver
Bermejo R, Krautgasser C, Deluca M, Pletz M, Supancic P, Aldrian F et al. Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments. Journal of Microelectronics and Electronic Packaging. 2016;13(1):17-22. doi: http://dx.doi.org/10.4071/imaps.491
Author
Bibtex - Download
@article{452d0ea5bd28408f8414ab9bcf6e8772,
title = "Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments",
author = "Raul Bermejo and Clemens Krautgasser and Marco Deluca and Martin Pletz and Peter Supancic and Franz Aldrian and Robert Danzer",
year = "2016",
doi = "http://dx.doi.org/10.4071/imaps.491",
language = "English",
volume = "13",
pages = "17--22",
journal = "Journal of Microelectronics and Electronic Packaging",
number = "1",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments
AU - Bermejo, Raul
AU - Krautgasser, Clemens
AU - Deluca, Marco
AU - Pletz, Martin
AU - Supancic, Peter
AU - Aldrian, Franz
AU - Danzer, Robert
PY - 2016
Y1 - 2016
U2 - http://dx.doi.org/10.4071/imaps.491
DO - http://dx.doi.org/10.4071/imaps.491
M3 - Article
VL - 13
SP - 17
EP - 22
JO - Journal of Microelectronics and Electronic Packaging
JF - Journal of Microelectronics and Electronic Packaging
IS - 1
ER -
