Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments

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@article{452d0ea5bd28408f8414ab9bcf6e8772,
title = "Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments",
author = "Raul Bermejo and Clemens Krautgasser and Marco Deluca and Martin Pletz and Peter Supancic and Franz Aldrian and Robert Danzer",
year = "2016",
doi = "http://dx.doi.org/10.4071/imaps.491",
language = "English",
volume = "13",
pages = "17--22",
journal = "Journal of Microelectronics and Electronic Packaging",
number = "1",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments

AU - Bermejo, Raul

AU - Krautgasser, Clemens

AU - Deluca, Marco

AU - Pletz, Martin

AU - Supancic, Peter

AU - Aldrian, Franz

AU - Danzer, Robert

PY - 2016

Y1 - 2016

U2 - http://dx.doi.org/10.4071/imaps.491

DO - http://dx.doi.org/10.4071/imaps.491

M3 - Article

VL - 13

SP - 17

EP - 22

JO - Journal of Microelectronics and Electronic Packaging

JF - Journal of Microelectronics and Electronic Packaging

IS - 1

ER -