Characterization and modeling of the AuSnCu thin solder joint under thermal cycling
Research output: Contribution to conference › Poster › Research › peer-review
Standard
Characterization and modeling of the AuSnCu thin solder joint under thermal cycling. / Pélisset, Tiphaine; Karunamurthy, Balamurugan; Otremba, Ralf et al.
2014. Poster session presented at 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014, Gent, Belgium.
2014. Poster session presented at 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014, Gent, Belgium.
Research output: Contribution to conference › Poster › Research › peer-review
Harvard
Pélisset, T, Karunamurthy, B, Otremba, R & Antretter, T 2014, 'Characterization and modeling of the AuSnCu thin solder joint under thermal cycling', 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014, Gent, Belgium, 7/04/14 - 9/04/14.
APA
Pélisset, T., Karunamurthy, B., Otremba, R., & Antretter, T. (2014). Characterization and modeling of the AuSnCu thin solder joint under thermal cycling. Poster session presented at 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014, Gent, Belgium.
Vancouver
Pélisset T, Karunamurthy B, Otremba R, Antretter T. Characterization and modeling of the AuSnCu thin solder joint under thermal cycling. 2014. Poster session presented at 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014, Gent, Belgium.
Author
Bibtex - Download
@conference{1d49c7f7b6244b13a97e379d8f9977e9,
title = "Characterization and modeling of the AuSnCu thin solder joint under thermal cycling",
author = "Tiphaine P{\'e}lisset and Balamurugan Karunamurthy and Ralf Otremba and Thomas Antretter",
year = "2014",
language = "English",
note = "15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014 ; Conference date: 07-04-2014 Through 09-04-2014",
}
RIS (suitable for import to EndNote) - Download
TY - CONF
T1 - Characterization and modeling of the AuSnCu thin solder joint under thermal cycling
AU - Pélisset, Tiphaine
AU - Karunamurthy, Balamurugan
AU - Otremba, Ralf
AU - Antretter, Thomas
PY - 2014
Y1 - 2014
M3 - Poster
T2 - 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014
Y2 - 7 April 2014 through 9 April 2014
ER -
