Characterization and modeling of the AuSnCu thin solder joint under thermal cycling
Publikationen: Konferenzbeitrag › Poster › Forschung › (peer-reviewed)
Standard
Characterization and modeling of the AuSnCu thin solder joint under thermal cycling. / Pélisset, Tiphaine; Karunamurthy, Balamurugan; Otremba, Ralf et al.
2014. Postersitzung präsentiert bei 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Gent, Belgien.
2014. Postersitzung präsentiert bei 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Gent, Belgien.
Publikationen: Konferenzbeitrag › Poster › Forschung › (peer-reviewed)
Harvard
Pélisset, T, Karunamurthy, B, Otremba, R & Antretter, T 2014, 'Characterization and modeling of the AuSnCu thin solder joint under thermal cycling', 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Gent, Belgien, 7/04/14 - 9/04/14.
APA
Pélisset, T., Karunamurthy, B., Otremba, R., & Antretter, T. (2014). Characterization and modeling of the AuSnCu thin solder joint under thermal cycling. Postersitzung präsentiert bei 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Gent, Belgien.
Vancouver
Pélisset T, Karunamurthy B, Otremba R, Antretter T. Characterization and modeling of the AuSnCu thin solder joint under thermal cycling. 2014. Postersitzung präsentiert bei 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Gent, Belgien.
Author
Bibtex - Download
@conference{1d49c7f7b6244b13a97e379d8f9977e9,
title = "Characterization and modeling of the AuSnCu thin solder joint under thermal cycling",
author = "Tiphaine P{\'e}lisset and Balamurugan Karunamurthy and Ralf Otremba and Thomas Antretter",
year = "2014",
language = "English",
note = "15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014 ; Conference date: 07-04-2014 Through 09-04-2014",
}
RIS (suitable for import to EndNote) - Download
TY - CONF
T1 - Characterization and modeling of the AuSnCu thin solder joint under thermal cycling
AU - Pélisset, Tiphaine
AU - Karunamurthy, Balamurugan
AU - Otremba, Ralf
AU - Antretter, Thomas
PY - 2014
Y1 - 2014
M3 - Poster
T2 - 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014
Y2 - 7 April 2014 through 9 April 2014
ER -
