Velislava Terziyska
Research output
- E-pub ahead of print
A new approach for in situ electrochemical nanoindentation: Side charging as a promising alternative
Zeiler, S., Jelinek, A., Terziyska, V., Schwaiger, R., Mitterer, C., Brinckmann, S. & Maier-Kiener, V., 14 Jun 2024, (E-pub ahead of print) In: Acta materialia. 276.2024, 1 September, 9 p., 120113.Research output: Contribution to journal › Article › Research › peer-review
- Published
Balancing the electro-mechanical and interfacial performance of Mo-based alloy films
Kreiml, P., Rausch, M., Terziyska, V., Köstenbauer, H., Winkler, J., Mitterer, C. & Cordill, M., 2020, In: Materialia. 12.2020, August, 7 p., 100774.Research output: Contribution to journal › Article › Research › peer-review
- Published
Combinatorial synthesis of Cr1−xAlxN and Ta1−xAlxN coatings using industrial scale co-sputtering
Schalk, N., Weirather, T., Sabitzer, C., Hirn, S., Terziyska, V., Gangopadhyay, S., Czettl, C., Polcik, P., Kathrein, M. & Mitterer, C., 2016, In: Surface engineering. 32, 4, p. 252-257 6 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Compressive and tensile bending of sputter deposited Al/Mo bilayers
Kreiml, P., Rausch, M., Terziyska, V., Winkler, J., Mitterer, C. & Cordill, M., 15 Mar 2019, In: Scripta materialia. 162.2019, March, p. 367-371 5 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Correlation of mechanical damage and electrical behavior of Al/Mo bilayers subjected to bending
Kreiml, P., Rausch, M., Terziyska, V. L., Köstenbauer, H., Winkler, J., Mitterer, C. & Cordill, M. J., 1 Oct 2019, In: Thin solid films. 687.2019, 1 October, 9 p., 137480.Research output: Contribution to journal › Article › Research › peer-review
- Published
Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers
Souli, I., Terziyska, V., Keckes, J., Zechner, J. & Mitterer, C., 2016.Research output: Contribution to conference › Presentation › Research
- Published
Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers
Souli, I., Terziyska, V., Keckes, J., Robl, W., Zechner, J. & Mitterer, C., 9 Feb 2017, In: Journal of vacuum science & technology / B (JVST). 35.2017, 2, 11 p., 022201.Research output: Contribution to journal › Article › Research › peer-review
- Published
Electro-mechanical behavior of Al/Mo bilayers studied with in situ straining methods
Kreiml, P., Rausch, M., Terziyska, V., Köstenbauer, H., Winkler, J., Mitterer, C. & Cordill, M., 2018, In: Thin solid films. p. 131-136Research output: Contribution to journal › Article › Research › peer-review
- E-pub ahead of print
Evolution of microstructure and mechanical properties of a grades TiAlON thin film investigated by cross-sectional characterization techniques
Schalk, N., Tkadletz, M., Terziyska, V., Deluca, M., Letofsky-Papst, I., Keckes, J. & Mitterer, C., 14 Dec 2018, (E-pub ahead of print) In: Surface & coatings technology. 315.2019, February, p. 155-161 7 p.Research output: Contribution to journal › Article › Research › peer-review
- E-pub ahead of print
Evolution of the microstructure of sputter deposited TaAlON thin films with increasing oxygen partial pressure
Schalk, N., Saringer, C., Fian, A., Terziyska, V., Julin, J. & Tkadletz, M., 29 Apr 2021, (E-pub ahead of print) In: Surface & coatings technology. 418.2021, 25. July, 7 p., 127237.Research output: Contribution to journal › Article › Research › peer-review