Thomas Antretter
Research output
- Published
Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
Macurova, K., Angerer, P., Antretter, T., Bermejo Moratinos, R., Maia, W., Schöngrundner, R., Krivec, T., Morianz, M. & Brizoux, M., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Stress and Deflection Development During Die Embedding into Printed Circuit Boards
Macurova, K., Angerer, P., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 2015, In: Materials Today: Proceedings. 2, 2, p. 4196-4205 10 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process
Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Apr 2015, In: Journal of Microelectronics and Electronic Packaging. 12.2015, 2, p. 80-85 6 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Model-Based Residual Stress Design in Multiphase Seamless Steel Tubes
Leitner, S., Winter, G., Klarner, J., Antretter, T. & Ecker, W., 16 Jan 2020, In: Materials. 13.2020, 2, 12 p., 439.Research output: Contribution to journal › Article › Research › peer-review
- Published
Analysis of shape, orientation and interface properties of Mo2C precipitates in Fe using ab-initio and finite element method calculations
Leitner, S., Scheiber, D., Dengg, T., Spitaler, J., Antretter, T. & Ecker, W., 1 Feb 2021, In: Acta materialia. 204.2021, 1 February, 11 p., 116478.Research output: Contribution to journal › Article › Research › peer-review
- Published
Residual Stress Evolution in Low-Alloyed Steel at Three Different Length Scales
Leitner, S., Winter, G., Klarner, J., Antretter, T. & Ecker, W., 23 Mar 2023, In: Materials. 16.2023, 7, 17 p., 2568.Research output: Contribution to journal › Article › Research › peer-review
- Published
Numerical Investigation of Thermal Cracks in Pressure Die Casting Tools
Leindl, M., Ecker, W., Antretter, T. & Ebner, R., 2008.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Numerische und experimentelle Untersuchung von Temperaturwechselrissnetzwerken
Leindl, M., Ecker, W., Ebner, R. & Antretter, T., 2008, Numerische und experimentelle Untersuchung von Temperaturwechselrissnetzwerken. p. 157-174Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Solution of a time-dependent heat conduction problem by an integral-equation approach
Leindl, M., Oberaigner, E. & Antretter, T., 2012, In: Computational materials science. p. 178-181Research output: Contribution to journal › Article › Research › peer-review
- Published
Solution of a time-dependent thermoelastic problem by an integral-equation approach
Leindl, M., Oberaigner, E. & Antretter, T., 2010, IWCMM20 - International Workshop on Computational Mechanics of Materials, Book of Abstracts. p. 50-50Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
