Peter Fuchs

(Former)

Research output

  1. Published

    Viscoelastic Behavior of Glass-Fiber-Reinforced Silicone Composites Exposed to Cyclic Loading

    Beter, J., Schrittesser, B., Lechner, B., Mansouri, M. R., Marano, C., Fuchs, P. F. & Pinter, G., 19 Aug 2020, In: Polymers. 12.2020, 9, 17 p., 1862.

    Research output: Contribution to journalArticleResearchpeer-review

  2. Published

    The Tension-Twist Coupling Mechanism in Flexible Composites: A Systematic Study Based on Tailored Laminate Structures Using a Novel Test Device

    Beter, J., Schrittesser, B., Meier, G., Lechner, B., Mansouri, M., Fuchs, P. F. & Pinter, G., 24 Nov 2020, In: Polymers. 12.2020, 12, p. 1-16 16 p., 2780.

    Research output: Contribution to journalArticleResearchpeer-review

  3. Published

    Influence of Fiber Orientation and Adhesion Properties On Tailored Fiber-reinforced Elastomers

    Beter, J., Schrittesser, B., Meier, G., Fuchs, P. F. & Pinter, G., 4 May 2020, In: Applied composite materials. 27.2020, 3, p. 149-164 16 p.

    Research output: Contribution to journalArticleResearchpeer-review

  4. Published

    Comparison and Impact of Different Fiber Debond Techniques on Fiber Reinforced Flexible Composites

    Beter, J., Schrittesser, B., Maroh, B., Sarlin, E., Fuchs, P. F. & Pinter, G., 18 Feb 2020, In: Polymers. 12.2020, 2, 11 p., 472.

    Research output: Contribution to journalArticleResearchpeer-review

  5. Published
  6. Published

    Finite element analysis of arbitrarily complex electronics devices

    Gschwandl, M., Fuchs, P., Fellner, K., Antretter, T., Krivec, T. & Tao, Q., 2016, Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016. p. 497-500

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  7. Published

    Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

    Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  8. Published

    A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

    Kamble, V. G., Patel, D. R., Schipfer, C., Thalhamer, A., Zuendel, J., Krivec, T., Antretter, T. & Fuchs, P. F., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  9. Published

    Quantifying matrix-fiber mechanical interactions in hyperelastic materials

    Mansouri, M. R., Beter, J., Fuchs, P. F., Schrittesser, B. & Pinter, G., 5 Jan 2021, In: International Journal of Mechanical Sciences. 195.2021, 1 April, 14 p., 106268.

    Research output: Contribution to journalArticleResearchpeer-review

  10. Published

    Gradient polymer composites for optimum heat dissipation

    Marx, P., Morak, M., Gschwandl, M., Fuchs, P., Antretter, T., Pfost, M., Kern, W. & Wiesbrock, F., 2018, In: Journal of the American Chemical Society. 2, 1 p., PMSE-772.

    Research output: Contribution to journalMeeting Abstract

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