Michael Reisinger

(Former)

Research output

  1. 2019
  2. Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior

    Du, C., Soeler, R., Völker, B., Matoy, K., Zechner, J., Langer, G., Reisinger, M., Todt, J., Kirchlechner, C. & Dehm, G., 1 Dec 2019, In: Materialia. 8.2019, 100503.

    Research output: Contribution to journalArticleResearchpeer-review

  3. 2017
  4. E-pub ahead of print

    Resolving alternating stress gradients and dislocation densities across AlxGa1-xN multilayer structures on Si(111)

    Reisinger, M., Tomberger, M., Zechner, J., Daumiller, I., Sartory, B., Ecker, W., Keckes, J. & Lechner, R. T., 16 Oct 2017, (E-pub ahead of print) In: Applied physics letters. 111.2017, 16, p. 162103 4 p.

    Research output: Contribution to journalArticleResearchpeer-review

  5. Published
  6. 2016
  7. Published

    Cross-sectional stress distribution in AlxGa1-xN heterostructure on Si(111) substrate characterized by ion beam layer removal method and precession electron diffraction

    Reisinger, M., Zalesak, J., Daniel, R., Tomberger, M., Weiss, J. K., Darbal, A. D., Petrenec, M., Zechner, J., Daumiller, I., Ecker, W., Sartory, B. & Keckes, J., 2016, In: Materials and Design. 106, p. 476-481 6 p.

    Research output: Contribution to journalArticleResearchpeer-review

  8. 2014
  9. Published

    Mikrobiegeversuche am PicoIndenter 85

    Reisinger, M., 2014

    Research output: ThesisDiploma Thesis