Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior
Research output: Contribution to journal › Article › Research › peer-review
Authors
External Organisational units
- Max-Planck-Institut für Eisenforschung GmbH
- Infineon Technologies AG Austria
- KAI - Kompetenzzentrum Automobil- und Industrieelektronik GmbH
- Erich Schmid Institute of Materials Science
- RWTH Aachen
Details
| Original language | English |
|---|---|
| Article number | 100503 |
| Journal | Materialia |
| Volume | 8.2019 |
| Early online date | 10 Oct 2019 |
| DOIs | |
| Publication status | Published - 1 Dec 2019 |
| Externally published | Yes |
