Martin Pletz
51 - 59 out of 59Page size: 10
Research output
- Published
Strength and fracture analysis of silicon-based components for embedding
Deluca, M., Bermejo Moratinos, R., Pletz, M., Supancic, P. & Danzer, R., 2011, In: Journal of the European Ceramic Society. 31, p. 549-558Research output: Contribution to journal › Article › Research › peer-review
- Published
Local strength measurement technique for miniaturised silicon-based components
Deluca, M., Pletz, M., Morianz, M., Stahr, J., Supancic, P., Danzer, R. & Bermejo, R., 2011, 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. 5765812Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Strength and fracture analysis of silicon chips to be embedded into printed circuit boards
Deluca, M., Bermejo, R., Pletz, M. & Supancic, P., 2010, 18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- E-pub ahead of print
A finite element model to simulate the physical mechanisms of wear and crack initiation in wheel/rail contact
Daves, W., Kubin, W., Scheriau, S. & Pletz, M., 9 Jun 2016, (E-pub ahead of print) In: Wear. 366-367.2016, 15 November, p. 78-83 6 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
FE Modelle zur indirekten Bestimmung des Reibkoeffizienten im Stauchversuch
Brunbauer, S., Kaufmann, A. & Pletz, M., 14 Apr 2016, p. 63-69.Research output: Contribution to conference › Paper
- Published
A method to reduce computation time in finite element simulations of deep rolling
Bialowas, J., Pletz, M., Gapp, S. & Maierhofer, J., 2023, In: Procedia Structural Integrity. 46, p. 49-55 7 p.Research output: Contribution to journal › Conference article › peer-review
- Published
Characterisation and modelling of the mechanical reliability of semiconductor components for Printed Circuit Boards
Bermejo Moratinos, R., Deluca, M., pletz, M., Supancic, P. & Danzer, R., 2010.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Mechanical characterization of miniaturized functional substrates and components in different environments
Bermejo, R., Krautgasser, C., Deluca, M., Pletz, M., Supancic, P., Aldrian, F. & Danzer, R., 1 Apr 2015Research output: Other contribution › Research
- Published
Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments
Bermejo, R., Krautgasser, C., Deluca, M., Pletz, M., Supancic, P., Aldrian, F. & Danzer, R., 2016, In: Journal of Microelectronics and Electronic Packaging. 13, 1, p. 17-22 6 p.Research output: Contribution to journal › Article › Research › peer-review
