Department Materials Science
Organisational unit: Departments and Institutes
Research output
- Published
Revealing effects of solute Ta on solidification and precipitation of Al-7Si-0.3Mg based alloys
Spacil, I., Holec, D., Albu, M. & LI, J., Aug 2023, In: Materialia. 30.2023, August, 17 p., 101846.Research output: Contribution to journal › Article › Research › peer-review
- Published
Effect of Solute Ta on Grain Refinement of Al-7Si-0.3Mg Based Alloys
Spacil, I., Holec, D., Schumacher, P. & Li, J., 2022, Semi-Solid of Alloys and Composites XVI - Selected peer-reviewed full text papers from the 16th International Conference on Semi-Solid Processing of Alloys and Composites, S2P 2021. Li, J. & Rassili, A. (eds.). Trans Tech Publications, p. 54-64 11 p. (Solid State Phenomena; vol. 327 SSP).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Effect of growth conditions on stress, texture, roughness and self-annealing behavior of sputter deposited Cu films
Souli, I. & Mitterer, C., 2015.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers
Souli, I., Terziyska, V., Keckes, J., Zechner, J. & Mitterer, C., 2016.Research output: Contribution to conference › Presentation › Research
- Published
Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers
Souli, I., Terziyska, V., Keckes, J., Robl, W., Zechner, J. & Mitterer, C., 9 Feb 2017, In: Journal of vacuum science & technology / B (JVST). 35.2017, 2, 11 p., 022201.Research output: Contribution to journal › Article › Research › peer-review
- Published
Microstructure and physical properties of sputter-deposited Cu-Mo thin films
Souli, I., Terziyska, V., Zechner, J. & Mitterer, C., 2018, In: Thin solid films. p. 301-308Research output: Contribution to journal › Article › Research › peer-review
- Published
Thermal stability of immiscible sputter-deposited Cu-Mo thin films
Souli, I., Gruber, G., Terziyska, V., Zechner, J. & Mitterer, C., 30 Apr 2019, In: Journal of alloys and compounds. 793.2019, April, p. 208-218 11 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Stress engineering to reduce mechanical loading in Cu-based metallizations
Souli, I., 2021Research output: Thesis › Doctoral Thesis
- Published
Intrinsic toughness of the bulk-metallic glass Vitreloy 105 measured using micro-cantilever beams
Sorensen, D., Hintsala, E., Stevick, J., Pischlar, J., Li, B., Kiener, D., Myers, J. C., Jin, H., Liu, J., Stauffer, D., Ramirez, A. J. & Ritchie, R. O., 15 Jan 2020, In: Acta Materialia. 183.2020, 15 January, p. 242-248 7 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Brittle-to-ductile transition in metallic glass nanowires
Şopu, D., Foroughi, A., Stoica, M. & Eckert, J., 13 Jul 2016, In: Nano Letters. 16.2016, 7, p. 4467-4471 5 p.Research output: Contribution to journal › Article › Research › peer-review
