Department Materials Science
Organisational unit: Departments and Institutes
Research output
- E-pub ahead of print
Metallic glass nanolaminates with shape memory alloys
Şopu, D., Albe, K. & Eckert, J., 22 Aug 2018, (E-pub ahead of print) In: Acta Materialia. 159.2018, 15. October, p. 344-351 8 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Rejuvenation engineering in metallic glasses by complementary stress and structure modulation
Şopu, D., Spieckermann, F., Bian, X., Fellner, S., Wright, J., Cordill, M., Gammer, C., Wang, G., Stoica, M. & Eckert, J., 24 Nov 2023, In: NPG Asia Materials. 2023, 15, 9 p., 61.Research output: Contribution to journal › Article › Research › peer-review
- Published
Coupling structural, chemical composition and stress fluctuations with relaxation dynamics in metallic glasses
Şopu, D., Yuan, X., Spieckermann, F. & Eckert, J., 15 Aug 2024, In: Acta Materialia. 275.2024, 15 August, 7 p., 120033.Research output: Contribution to journal › Article › Research › peer-review
- Published
Intrinsic toughness of the bulk-metallic glass Vitreloy 105 measured using micro-cantilever beams
Sorensen, D., Hintsala, E., Stevick, J., Pischlar, J., Li, B., Kiener, D., Myers, J. C., Jin, H., Liu, J., Stauffer, D., Ramirez, A. J. & Ritchie, R. O., 15 Jan 2020, In: Acta Materialia. 183.2020, 15 January, p. 242-248 7 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Effect of growth conditions on stress, texture, roughness and self-annealing behavior of sputter deposited Cu films
Souli, I. & Mitterer, C., 2015.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers
Souli, I., Terziyska, V., Keckes, J., Zechner, J. & Mitterer, C., 2016.Research output: Contribution to conference › Presentation › Research
- Published
Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers
Souli, I., Terziyska, V., Keckes, J., Robl, W., Zechner, J. & Mitterer, C., 9 Feb 2017, In: Journal of vacuum science & technology / B (JVST). 35.2017, 2, 11 p., 022201.Research output: Contribution to journal › Article › Research › peer-review
- Published
Microstructure and physical properties of sputter-deposited Cu-Mo thin films
Souli, I., Terziyska, V., Zechner, J. & Mitterer, C., 2018, In: Thin solid films. p. 301-308Research output: Contribution to journal › Article › Research › peer-review
- Published
Thermal stability of immiscible sputter-deposited Cu-Mo thin films
Souli, I., Gruber, G., Terziyska, V., Zechner, J. & Mitterer, C., 30 Apr 2019, In: Journal of alloys and compounds. 793.2019, April, p. 208-218 11 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Stress engineering to reduce mechanical loading in Cu-based metallizations
Souli, I., 2021Research output: Thesis › Doctoral Thesis
