Global least squares for time-domain system identification of state-space models

Harker, M. & Rath, G., 6 Juli 2018, 2018 7th Mediterranean Conference on Embedded Computing, MECO 2018 - Including ECYPS 2018, Proceedings. Institute of Electrical and Electronics Engineers, S. 1-6 6 S.

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Frequency elastic drive system operation of sucker rod pumping system

Langbauer, C. & Winkler, T., 18 Apr. 2018, Proceedings - 2018 17th International Ural Conference on AC Electric Drives, ACED 2018. Institute of Electrical and Electronics Engineers, Band 2018-April. S. 1-5 5 S.

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Fracture mechanics of thin film systems on the sub-micron scale

Kozic, D., Treml, R., Schongrundner, R., Brunner, R., Kiener, D., Zechner, J., Antretter, T. & Ganser, H. P., 6 Mai 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 7103088

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Fracture and Material Behavior of Thin Film composites

Kozic, D., Konetschnik, R., Maier-Kiener, V., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T. & Gänser, H.-P., 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . Institute of Electrical and Electronics Engineers, S. 1-6 6 S.

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Force based Tool Wear Detection using Shannon Entropy and Phase Plane

Kollment, W., O'Leary, P., Ritt, R. & Kluensner, T., 5 Juli 2017, I2MTC 2017 - 2017 IEEE International Instrumentation and Measurement Technology Conference, Proceedings. Institute of Electrical and Electronics Engineers, 7969765

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Force and acoustic emission measurements for condition monitoring of fine blanking tools

Kollment, W., O'Leary, P., Harker, M., Klunsner, T. & Eck, S., 10 Juli 2018, I2MTC 2018 - 2018 IEEE International Instrumentation and Measurement Technology Conference: Discovering New Horizons in Instrumentation and Measurement, Proceedings. Institute of Electrical and Electronics Engineers, S. 1-6 6 S.

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Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics

Peng, C., Tao, Q., Krivec, T., Casas, G., Latorre, S., Antretter, T., Macher, J. & Fuchs, P., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

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Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method

Kozic, D., Treml, R., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T. & Gänser, H.-P., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. Zhang, G. Q., Van Driel, W. D., Rodgers, P., Bailey, C. & de Saint Leger, O. (Hrsg.). Institute of Electrical and Electronics Engineers, 6813785

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Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. & Novak, P., 5 März 2019, EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers, 8660763. (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging).

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