X-ray nanodiffraction analysis of stress oscillations in a W thin film on through-silicon via

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X-ray nanodiffraction analysis of stress oscillations in a W thin film on through-silicon via. / Todt, J.; Hammer, H.; Sartory, B. et al.
in: Journal of applied crystallography, Jahrgang 49, 2016, S. 182-187.

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

Vancouver

Todt J, Hammer H, Sartory B, Burghammer M, Kraft J, Daniel R et al. X-ray nanodiffraction analysis of stress oscillations in a W thin film on through-silicon via. Journal of applied crystallography. 2016;49:182-187. doi: 10.1107/S1600576715023419

Bibtex - Download

@article{f52baf10c55a41f7b6f910ce017e31ab,
title = "X-ray nanodiffraction analysis of stress oscillations in a W thin film on through-silicon via",
author = "J. Todt and H. Hammer and B. Sartory and M. Burghammer and J. Kraft and R. Daniel and J. Keckes and S. Defregger",
note = "cited By 1",
year = "2016",
doi = "10.1107/S1600576715023419",
language = "Undefined/Unknown",
volume = "49",
pages = "182--187",
journal = "Journal of applied crystallography",
issn = "0021-8898",
publisher = "International Union of Crystallography",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - X-ray nanodiffraction analysis of stress oscillations in a W thin film on through-silicon via

AU - Todt, J.

AU - Hammer, H.

AU - Sartory, B.

AU - Burghammer, M.

AU - Kraft, J.

AU - Daniel, R.

AU - Keckes, J.

AU - Defregger, S.

N1 - cited By 1

PY - 2016

Y1 - 2016

U2 - 10.1107/S1600576715023419

DO - 10.1107/S1600576715023419

M3 - Article

VL - 49

SP - 182

EP - 187

JO - Journal of applied crystallography

JF - Journal of applied crystallography

SN - 0021-8898

ER -