Publikationen

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2016
Veröffentlicht
The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates
Glushko, O., Cordill, M., Klug, A. & List-Kratochvil, E. J. W., 2016, in: Microelectronics Reliability.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Veröffentlicht
The electro-mechanical behavior of sputter- deposited Mo thin films on flexible substrates
Jörg, T., Cordill, M., Franz, R., Glushko, O., Winkler, J. & Mitterer, C., 2016, in: Thin solid films. 606, S. 45-50 6 S.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
2015
Veröffentlicht
Thermally Activated Deformation Behavior of ufg-Au: Environmental Issues During Long-Term and High-Temperature Nanoindentation Testing
Maier, V., Leitner, A., Pippan, R. & Kiener, D., 1 Dez. 2015, in: JOM. 67, 12, S. 2934-2944 11 S.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Veröffentlicht
Tracking of Grain Boundary Movement Due to (Thermo-) Mechanical Deformation
Wurster, S., Bigl, S., Renk, O., Cordill, M. J., Hohenwarter, A., Pippan, R. & Kiener, D., 24 Nov. 2015.
Publikationen: Konferenzbeitrag › Vortrag › Forschung
Veröffentlicht
In-Situ Measurements of Free-Standing, Ultra-Thin Film Cracking in Bending
Hintsala, E., Kiener, D., Jackson, J. & Gerberich, W. W., 1 Nov. 2015, in: Experimental mechanics. 55, 9, S. 1681-1690 10 S.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Veröffentlicht
In Situ TEM Microcompression of Single and Bicrystalline Samples: Insights and Limitations
Imrich, P. J., Kirchlechner, C., Kiener, D. & Dehm, G., 19 Mai 2015, in: JOM. 67, 8, S. 1704 1712 S.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Veröffentlicht
Fracture mechanics of thin film systems on the sub-micron scale
Kozic, D., Treml, R., Schongrundner, R., Brunner, R., Kiener, D., Zechner, J., Antretter, T. & Ganser, H. P., 6 Mai 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 7103088
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Veröffentlicht
Microstructure and mechanical properties of Cu_xNb_1- _x alloys prepared by ball milling and high pressure torsion compacting
Abad, M. D., Parker, S., Kiener, D., Primorac, M. M. & Hosemann, P., 5 Mai 2015, in: Journal of alloys and compounds. 630, S. 117-125 9 S.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Veröffentlicht
Internal and external stresses: In situ TEM compression of Cu bicrystals containing a twin boundary
Imrich, P. J., Kirchlechner, C., Kiener, D. & Dehm, G., 15 Apr. 2015, in: Scripta materialia. 100, S. 94-97 4 S.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Veröffentlicht
Influence of Microstructure on the Deformation Behaviour of Chromium
Fritz, R., Wimler, D., Krautgasser, C., Leitner, A., Maier, V. & Kiener, D., 9 Apr. 2015.
Publikationen: Konferenzbeitrag › Poster › Forschung

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Forschungsportal

Publikationen

The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates

The electro-mechanical behavior of sputter- deposited Mo thin films on flexible substrates

Thermally Activated Deformation Behavior of ufg-Au: Environmental Issues During Long-Term and High-Temperature Nanoindentation Testing

Tracking of Grain Boundary Movement Due to (Thermo-) Mechanical Deformation

In-Situ Measurements of Free-Standing, Ultra-Thin Film Cracking in Bending

In Situ TEM Microcompression of Single and Bicrystalline Samples: Insights and Limitations

Fracture mechanics of thin film systems on the sub-micron scale

Microstructure and mechanical properties of Cu_xNb_1- _x alloys prepared by ball milling and high pressure torsion compacting

Internal and external stresses: In situ TEM compression of Cu bicrystals containing a twin boundary

Influence of Microstructure on the Deformation Behaviour of Chromium

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