Microstructure and stress gradients in TiW thin films characterized by 40 nm X-ray diffraction and transmission electron microscopy
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in: Thin solid films, Jahrgang 691.2019, Nr. 1 December, 137576, 14.10.2019.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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TY - JOUR
T1 - Microstructure and stress gradients in TiW thin films characterized by 40 nm X-ray diffraction and transmission electron microscopy
AU - Saghaeian, Fahimeh
AU - Keckes, Jozef
AU - Woehlert, Stefan
AU - Rosenthal, M.
AU - Reisinger, M.
AU - Todt, J.
PY - 2019/10/14
Y1 - 2019/10/14
KW - Internal stress
KW - Residual stress
KW - Thin film
KW - Titanium tungsten, Diffusion barrier
KW - X-ray nanodiffraction
UR - http://www.scopus.com/inward/record.url?scp=85073521309&partnerID=8YFLogxK
U2 - 10.1016/j.tsf.2019.137576
DO - 10.1016/j.tsf.2019.137576
M3 - Article
AN - SCOPUS:85073521309
VL - 691.2019
JO - Thin solid films
JF - Thin solid films
SN - 0040-6090
IS - 1 December
M1 - 137576
ER -