High-temperature residual stresses in thin films characterized by x-ray diffraction substrate curvature method

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

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High-temperature residual stresses in thin films characterized by x-ray diffraction substrate curvature method. / Keckes, Jozef; Eiper, E.; Martinschitz, K.J. et al.
in: Review of scientific instruments, Jahrgang 78, 2007, S. 036103-01-036103-03.

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

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@article{69c760115f624ab5b0920d437fae853a,
title = "High-temperature residual stresses in thin films characterized by x-ray diffraction substrate curvature method",
author = "Jozef Keckes and E. Eiper and K.J. Martinschitz and Harald K{\"o}stenbauer and Rostislav Daniel and Christian Mitterer",
year = "2007",
doi = "10.1063/1.2535857",
language = "English",
volume = "78",
pages = "036103--01--036103--03",
journal = "Review of scientific instruments",
issn = "0034-6748",
publisher = "American Institute of Physics Publising LLC",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - High-temperature residual stresses in thin films characterized by x-ray diffraction substrate curvature method

AU - Keckes, Jozef

AU - Eiper, E.

AU - Martinschitz, K.J.

AU - Köstenbauer, Harald

AU - Daniel, Rostislav

AU - Mitterer, Christian

PY - 2007

Y1 - 2007

U2 - 10.1063/1.2535857

DO - 10.1063/1.2535857

M3 - Article

VL - 78

SP - 036103-01-036103-03

JO - Review of scientific instruments

JF - Review of scientific instruments

SN - 0034-6748

ER -