Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue
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in: Journal of materials research (JMR), Jahrgang 32.2017, Nr. 11, 01.06.2017, S. 2022-2034.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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T1 - Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue
AU - Bigl, Stephan
AU - Trost, Claus Othmar Wolfgang
AU - Wurster, Stefan
AU - Cordill, Megan J.
AU - Kiener, Daniel
PY - 2017/6/1
Y1 - 2017/6/1
N2 - With increasing performance requirements in power electronics, the necessity has emerged to investigate the thermo-mechanical behavior of thick Cu metallizations (≥5 μm). Cu films on rigid substrates in the range of 5-20 μm were thermally cycled between 170 and 400 °C by a fast laser device. Compared to the initial microstructures, a texture transition toward the {100} out-of-plane orientation with increasing film thickness was observed during thermo-mechanical cycling, along with an abnormal grain growth in the {100}-oriented grains and a gradual development of substructures in a crystallographic arrangement. Compared to the well-studied thin Cu film counterparts (≤5 μm), the surface damage showed a 1/h f dependency. Transition from an orientation independent (h f = 5 μm) to an orientation specific thermo-mechanical fatigue damage (h f = 10, 20 μm) was observed following a higher damager tolerance in {100} oriented grains.
AB - With increasing performance requirements in power electronics, the necessity has emerged to investigate the thermo-mechanical behavior of thick Cu metallizations (≥5 μm). Cu films on rigid substrates in the range of 5-20 μm were thermally cycled between 170 and 400 °C by a fast laser device. Compared to the initial microstructures, a texture transition toward the {100} out-of-plane orientation with increasing film thickness was observed during thermo-mechanical cycling, along with an abnormal grain growth in the {100}-oriented grains and a gradual development of substructures in a crystallographic arrangement. Compared to the well-studied thin Cu film counterparts (≤5 μm), the surface damage showed a 1/h f dependency. Transition from an orientation independent (h f = 5 μm) to an orientation specific thermo-mechanical fatigue damage (h f = 10, 20 μm) was observed following a higher damager tolerance in {100} oriented grains.
KW - fatigue
KW - texture
KW - thermal stresses
UR - http://www.scopus.com/inward/record.url?scp=85020723130&partnerID=8YFLogxK
U2 - 10.1557/jmr.2017.199
DO - 10.1557/jmr.2017.199
M3 - Article
AN - SCOPUS:85020723130
VL - 32.2017
SP - 2022
EP - 2034
JO - Journal of materials research (JMR)
JF - Journal of materials research (JMR)
SN - 0884-2914
IS - 11
ER -