Matthias M. Morak
(Ehemalig)
1 - 4 von 4Seitengröße: 10
Publikationen
- 2022
- Veröffentlicht
Characterization and modeling of a typical curing material for photoresist films
Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- 2021
- Veröffentlicht
Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr. 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- 2020
- Veröffentlicht
The crucial role of external force in the estimation of the topology freezing transition temperature of vitrimers by elongational creep measurements
Kaiser, S., Novak, P., Giebler, M., Gschwandl, M., Novak, P., Pilz, G., Morak, M. & Schlögl, S., 9 Sept. 2020, in: Polymer. 204, 122804.Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
- 2019
- Veröffentlicht
Nonlinear material modeling and simulation of thermoplastics
Morak, M. M., 2019Publikationen: Thesis / Studienabschlussarbeiten und Habilitationsschriften › Dissertation
