Institute of Electrical and Electronics Engineers

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Research output

  1. Published

    Dynamic Mechanical Response in Epoxy Nanocomposites Incorporating Various Nano-Silica Architectures

    Chaudhary, S., Vryonis, O., Vaughan, A. S., Andritsch, T. & Feuchter, M., 2022, ICD 2022 - IEEE 2022 4th International Conference on Dielectrics, Proceedings. Institute of Electrical and Electronics Engineers, p. 86-89 4 p. (ICD 2022 - IEEE 2022 4th International Conference on Dielectrics, Proceedings).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  2. Published

    Effect of water absorption on dielectric spectrum of nanocomposites

    Kochetov, R., Tsekmes, I. A., Morshuis, P. H. F., Smit, J. J., Wanner, A. J., Wiesbrock, F. & Kern, W., 22 Aug 2016, 34th Electrical Insulation Conference, EIC 2016. Institute of Electrical and Electronics Engineers, p. 579-582 4 p. 7548669

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  3. Published

    Effects of artificial ageing tests on EVA degradation: Influence of microclimate and methodology approach

    Barretta, C., Oreski, G., Kyranaki, N., Mansour, D. E., Betts, T. R., Bauermann, L. P. & Resch-Fauster, K., 20 Jun 2021, 2021 IEEE 48th Photovoltaic Specialists Conference, PVSC 2021. Institute of Electrical and Electronics Engineers, p. 312-315 4 p. (Conference Record of the IEEE Photovoltaic Specialists Conference).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  4. Effects of unbalanced mains voltage conditions on three-phase hybrid rectifiers employing third harmonic injection

    Makoschitz, M., Hartmanny, M. & Ertl, H., 2 Nov 2015, Proceedings - 2015 International Symposium on Smart Electric Distribution Systems and Technologies, EDST 2015. Institute of Electrical and Electronics Engineers, p. 417-424 8 p. 7315245. (Proceedings - 2015 International Symposium on Smart Electric Distribution Systems and Technologies, EDST 2015).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  5. Published

    Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

    Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  6. Published

    Estimating Parameters of a Sine Wave by the Method of Variable Projection

    O'Leary, P. & Ninevski, D., 17 May 2021, I2MTC 2021 - IEEE International Instrumentation and Measurement Technology Conference, Proceedings. Institute of Electrical and Electronics Engineers, 9459842. (Conference Record - IEEE Instrumentation and Measurement Technology Conference; vol. 2021-May).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  7. Evaluation of a unidirectional three-phase rectifier based on the third harmonic injection concept in comparison to a VIENNA Rectifier

    Makoschitz, M., Hartmann, M. & Ertl, H., 2016, PCIM Europe 2016; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Institute of Electrical and Electronics Engineers, p. 1669-1676 8 p. 7499553. (PCIM Europe 2016; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  8. Published

    Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

    Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. & Novak, P., 5 Mar 2019, EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers, 8660763. (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  9. Published

    Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method

    Kozic, D., Treml, R., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T. & Gänser, H.-P., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. Zhang, G. Q., Van Driel, W. D., Rodgers, P., Bailey, C. & de Saint Leger, O. (eds.). Institute of Electrical and Electronics Engineers, 6813785

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  10. Published

    Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics

    Peng, C., Tao, Q., Krivec, T., Casas, G., Latorre, S., Antretter, T., Macher, J. & Fuchs, P., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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