The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates

Research output: Contribution to journalArticleResearchpeer-review

Authors

Organisational units

External Organisational units

  • Erich Schmid Institute of Materials Science

Details

Original languageEnglish
JournalMicroelectronics Reliability
DOIs
Publication statusPublished - 2016