The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates
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The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates. / Glushko, Oleksandr; Cordill, Megan; Klug, A. et al.
In: Microelectronics Reliability, 2016.
In: Microelectronics Reliability, 2016.
Research output: Contribution to journal › Article › Research › peer-review
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Glushko O, Cordill M, Klug A, List-Kratochvil EJW. The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates. Microelectronics Reliability. 2016. doi: doi:10.1016/j.microrel.2015.10.007
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@article{970cffb8dc9c4fb087bf13a4bfebd251,
title = "The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates",
author = "Oleksandr Glushko and Megan Cordill and A. Klug and E.J.W. List-Kratochvil",
year = "2016",
doi = "doi:10.1016/j.microrel.2015.10.007",
language = "English",
journal = "Microelectronics Reliability",
issn = "0026-2714",
publisher = "Elsevier",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates
AU - Glushko, Oleksandr
AU - Cordill, Megan
AU - Klug, A.
AU - List-Kratochvil, E.J.W.
PY - 2016
Y1 - 2016
U2 - doi:10.1016/j.microrel.2015.10.007
DO - doi:10.1016/j.microrel.2015.10.007
M3 - Article
JO - Microelectronics Reliability
JF - Microelectronics Reliability
SN - 0026-2714
ER -
