Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing
Research output: Contribution to journal › Article › Research › peer-review
Standard
Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing. / Huang, R.; Robl, W.; Ceric, H. et al.
In: IEEE transactions on device and materials reliability, Vol. 10, No. 1, 2010, p. 47-54.
In: IEEE transactions on device and materials reliability, Vol. 10, No. 1, 2010, p. 47-54.
Research output: Contribution to journal › Article › Research › peer-review
Harvard
Huang, R, Robl, W, Ceric, H, Detzel, T & Dehm, G 2010, 'Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing', IEEE transactions on device and materials reliability, vol. 10, no. 1, pp. 47-54. https://doi.org/10.1109/TDMR.2009.2032768
APA
Huang, R., Robl, W., Ceric, H., Detzel, T., & Dehm, G. (2010). Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing. IEEE transactions on device and materials reliability, 10(1), 47-54. https://doi.org/10.1109/TDMR.2009.2032768
Vancouver
Huang R, Robl W, Ceric H, Detzel T, Dehm G. Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing. IEEE transactions on device and materials reliability. 2010;10(1):47-54. doi: 10.1109/TDMR.2009.2032768
Author
Bibtex - Download
@article{2da96328a16849dead6b944aef86e2a1,
title = "Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing",
author = "R. Huang and W. Robl and H. Ceric and T. Detzel and Gerhard Dehm",
year = "2010",
doi = "10.1109/TDMR.2009.2032768",
language = "English",
volume = "10",
pages = "47--54",
journal = "IEEE transactions on device and materials reliability",
issn = "1530-4388",
publisher = "Institute of Electrical and Electronics Engineers",
number = "1",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing
AU - Huang, R.
AU - Robl, W.
AU - Ceric, H.
AU - Detzel, T.
AU - Dehm, Gerhard
PY - 2010
Y1 - 2010
U2 - 10.1109/TDMR.2009.2032768
DO - 10.1109/TDMR.2009.2032768
M3 - Article
VL - 10
SP - 47
EP - 54
JO - IEEE transactions on device and materials reliability
JF - IEEE transactions on device and materials reliability
SN - 1530-4388
IS - 1
ER -
