Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing
Research output: Contribution to journal › Article › Research › peer-review
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| Translated title of the contribution | Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing |
|---|---|
| Original language | English |
| Pages (from-to) | 47-54 |
| Journal | IEEE transactions on device and materials reliability |
| Volume | 10 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 2010 |
