IEEE transactions on device and materials reliability, 1530-4388
Journal
| ISSNs | 1530-4388 |
|---|---|
| Additional searchable ISSN (electronic) | 1558-2574 |
1 - 1 out of 1Page size: 10
Research output
- 2010
- Published
Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing
Huang, R., Robl, W., Ceric, H., Detzel, T. & Dehm, G., 2010, In: IEEE transactions on device and materials reliability. 10, 1, p. 47-54Research output: Contribution to journal › Article › Research › peer-review
