Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Standard
Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards. / Macurova, Katerina; Angerer, Paul; Antretter, Thomas et al.
Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. 2014.
Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. 2014.
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Harvard
Macurova, K, Angerer, P, Antretter, T, Bermejo Moratinos, R, Maia, W, Schöngrundner, R, Krivec, T, Morianz, M & Brizoux, M 2014, Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards. in Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.
APA
Macurova, K., Angerer, P., Antretter, T., Bermejo Moratinos, R., Maia, W., Schöngrundner, R., Krivec, T., Morianz, M., & Brizoux, M. (2014). Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards. In Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014
Vancouver
Macurova K, Angerer P, Antretter T, Bermejo Moratinos R, Maia W, Schöngrundner R et al. Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards. In Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. 2014
Author
Bibtex - Download
@inproceedings{8b1c08bab16d486c932af403b60810a1,
title = "Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards",
author = "Katerina Macurova and Paul Angerer and Thomas Antretter and {Bermejo Moratinos}, Raul and Wilson Maia and Ronald Sch{\"o}ngrundner and Thomas Krivec and Mike Morianz and Michel Brizoux",
year = "2014",
language = "English",
isbn = "978-1-4799-4791-1",
booktitle = "Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014",
}
RIS (suitable for import to EndNote) - Download
TY - GEN
T1 - Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
AU - Macurova, Katerina
AU - Angerer, Paul
AU - Antretter, Thomas
AU - Bermejo Moratinos, Raul
AU - Maia, Wilson
AU - Schöngrundner, Ronald
AU - Krivec, Thomas
AU - Morianz, Mike
AU - Brizoux, Michel
PY - 2014
Y1 - 2014
M3 - Conference contribution
SN - 978-1-4799-4791-1
BT - Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014
ER -
