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2024
E-pub ahead of print
A new approach for in situ electrochemical nanoindentation: Side charging as a promising alternative
Zeiler, S., Jelinek, A., Terziyska, V., Schwaiger, R., Mitterer, C., Brinckmann, S. & Maier-Kiener, V., 14 Jun 2024, (E-pub ahead of print) In: Acta materialia. 276.2024, 1 September, 9 p., 120113.
Research output: Contribution to journal › Article › Research › peer-review
Published
Short-Time Magnetron Sputtering for the Development of Carbon–Palladium Nanocomposites
Knabl, F., Kostoglou, N., Terziyska, V., Hinder, S. J., Baker, M., Bousser, E., Rebholz, C. & Mitterer, C., 12 Jan 2024, In: Nanomaterials. 14.2024, 2, 10 p., 164.
Research output: Contribution to journal › Article › Research › peer-review
2023
Published
Precious metal amorphous AgAuSi: Alloy design by swapping gold for silver
Weniger, L-M., Gammer, C., Niewczas, M., Cordill, M. J., Spieckermann, F., Djemia, P., Faurie, D., Li, C-H., Lassnig, A., Terziyska, V., Mitterer, C., Eckert, J. & Glushko, O., 17 Jun 2023, In: Materials and Design. 232.2023, August, 11 p., 112099.
Research output: Contribution to journal › Article › Research › peer-review
2021
E-pub ahead of print
Evolution of the microstructure of sputter deposited TaAlON thin films with increasing oxygen partial pressure
Schalk, N., Saringer, C., Fian, A., Terziyska, V., Julin, J. & Tkadletz, M., 29 Apr 2021, (E-pub ahead of print) In: Surface & coatings technology. 418.2021, 25. July, 7 p., 127237.
Research output: Contribution to journal › Article › Research › peer-review
E-pub ahead of print
Improved electro-mechanical reliability of flexible systems with alloyed Mo-Ta adhesion layers
Kreiml, P., Rausch, M., Terziyska, V., Köstenbauer, H., Winkler, J., Mitterer, C. & Cordill, M. J., 9 Jan 2021, (E-pub ahead of print) In: Thin solid films. 720.2021, 28 February, 9 p., 138533.
Research output: Contribution to journal › Article › Research › peer-review
2020
Published
Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices
Lassnig, A., Terziyska, V. L., Zalesak, J., Jörg, T., Toebbens, D. M., Griesser, T., Mitterer, C., Pippan, R. & Cordill, M. J., 28 Dec 2020, In: ACS Applied Nano Materials. 4.2021, 1, p. 61-70 10 p.
Research output: Contribution to journal › Article › Research › peer-review
Published
Molecular Coverage Determines Sliding Wear Behavior of n-Octadecylphosphonic Acid Functionalized Cu–O Coated Steel Disks against Aluminum
Prünte, S., Music, D., Terziyska, V., Mitterer, C. & Schneider, J. M., 1 Jan 2020, In: Materials. 13.2020, 2, 10 p., 280.
Research output: Contribution to journal › Article › Research › peer-review
Published
Balancing the electro-mechanical and interfacial performance of Mo-based alloy films
Kreiml, P., Rausch, M., Terziyska, V., Köstenbauer, H., Winkler, J., Mitterer, C. & Cordill, M., 2020, In: Materialia. 12.2020, August, 7 p., 100774.
Research output: Contribution to journal › Article › Research › peer-review
2019
Published
Correlation of mechanical damage and electrical behavior of Al/Mo bilayers subjected to bending
Kreiml, P., Rausch, M., Terziyska, V. L., Köstenbauer, H., Winkler, J., Mitterer, C. & Cordill, M. J., 1 Oct 2019, In: Thin solid films. 687.2019, 1 October, 9 p., 137480.
Research output: Contribution to journal › Article › Research › peer-review
Published
Thermal stability of immiscible sputter-deposited Cu-Mo thin films
Souli, I., Gruber, G., Terziyska, V., Zechner, J. & Mitterer, C., 30 Apr 2019, In: Journal of alloys and compounds. 793.2019, April, p. 208-218 11 p.
Research output: Contribution to journal › Article › Research › peer-review

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Research Portal

Research output

A new approach for in situ electrochemical nanoindentation: Side charging as a promising alternative

Short-Time Magnetron Sputtering for the Development of Carbon–Palladium Nanocomposites

Precious metal amorphous AgAuSi: Alloy design by swapping gold for silver

Evolution of the microstructure of sputter deposited TaAlON thin films with increasing oxygen partial pressure

Improved electro-mechanical reliability of flexible systems with alloyed Mo-Ta adhesion layers

Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices

Molecular Coverage Determines Sliding Wear Behavior of n-Octadecylphosphonic Acid Functionalized Cu–O Coated Steel Disks against Aluminum

Balancing the electro-mechanical and interfacial performance of Mo-based alloy films

Correlation of mechanical damage and electrical behavior of Al/Mo bilayers subjected to bending

Thermal stability of immiscible sputter-deposited Cu-Mo thin films

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