Research output

  1. 2017
  2. Published
  3. Published

    The driving force governing room temperature grain coarsening in thin gold films

    Glushko, O. & Cordill, M., 2017, In: Scripta Materialia. 130.2017, 15 March, p. 42-45 4 p.

    Research output: Contribution to journalArticleResearchpeer-review

  4. Published

    Thin Film Adhesion of Flexible Electronics Influenced by Interlayers

    Kleinbichler, A., Bartosik, M., Völker, B. & Cordill, M., 2017, In: Advanced engineering materials. 19.2017, 4, 7 p., 1600665.

    Research output: Contribution to journalArticleResearchpeer-review

  5. 2016
  6. Published

    Correlative microstructure and topography informed nanoindentation of copper films

    Bigl, S., Schöberl, T., Wurster, S., Cordill, M. & Kiener, D., 25 Dec 2016, In: Surface & coatings technology. 308.2016, 25 December, p. 404-413 10 p.

    Research output: Contribution to journalArticleResearchpeer-review

  7. E-pub ahead of print

    Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces

    Kleinbichler, A., Zechner, J. & Cordill, M., 2 Nov 2016, (E-pub ahead of print) In: Microelectronic engineering. 167.2017, 5 January, p. 63-68 6 p.

    Research output: Contribution to journalArticleResearchpeer-review

  8. Published

    Grain growth during cyclic straining of copper film revealed with in-situ resistance measurements

    Cordill, M. & Glushko, O., 25 Oct 2016.

    Research output: Contribution to conferencePosterResearchpeer-review

  9. Published

    Ultra-strong and damage tolerant metallic bulk materials: A lesson from nanostructured pearlitic steel wires

    Hohenwarter, A., Völker, B., Kapp, M., Li, Y., Goto, S., Raabe, D. & Pippan, R., 14 Sept 2016, In: Scientific reports (London : Nature Publishing Group). 6.2016, 10 p., 33228.

    Research output: Contribution to journalArticleResearchpeer-review

  10. Published

    Phase decomposition of a nanocrystalline AlNbTiV high-entropy alloy

    Schuh, B., Völker, B., Todt, J., Hohenwarter, A., Maier-Kiener, V. & Li, J., 5 Aug 2016.

    Research output: Contribution to conferencePresentationResearch

  11. Published

    Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations

    Bigl, S., Wurster, S., Cordill, M. & Kiener, D., 1 Aug 2016, In: Thin solid films. 612.2016, 1 August, p. 153-164 12 p.

    Research output: Contribution to journalArticleResearchpeer-review

  12. Published

    Microstructural and mechanical comparison of Ti and Ti-alloys after severe plastic deformation

    Völker, B., Jäger, N., Wurster, S., Hohenwarter, A. & Pippan, R., 2 Jun 2016.

    Research output: Contribution to conferencePresentationResearch

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