Research output

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  1. 2016
  2. Published

    The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates

    Glushko, O., Cordill, M., Klug, A. & List-Kratochvil, E. J. W., 2016, In: Microelectronics Reliability.

    Research output: Contribution to journal › Article › Research › peer-review

  3. Published

    The electro-mechanical behavior of sputter- deposited Mo thin films on flexible substrates

    Jörg, T., Cordill, M., Franz, R., Glushko, O., Winkler, J. & Mitterer, C., 2016, In: Thin solid films. 606, p. 45-50 6 p.

    Research output: Contribution to journal › Article › Research › peer-review

  4. 2015
  5. Published

    Thermally Activated Deformation Behavior of ufg-Au: Environmental Issues During Long-Term and High-Temperature Nanoindentation Testing

    Maier, V., Leitner, A., Pippan, R. & Kiener, D., 1 Dec 2015, In: JOM. 67, 12, p. 2934-2944 11 p.

    Research output: Contribution to journal › Article › Research › peer-review

  6. Published

    Tracking of Grain Boundary Movement Due to (Thermo-) Mechanical Deformation

    Wurster, S., Bigl, S., Renk, O., Cordill, M. J., Hohenwarter, A., Pippan, R. & Kiener, D., 24 Nov 2015.

    Research output: Contribution to conference › Presentation › Research

  7. Published

    In-Situ Measurements of Free-Standing, Ultra-Thin Film Cracking in Bending

    Hintsala, E., Kiener, D., Jackson, J. & Gerberich, W. W., 1 Nov 2015, In: Experimental mechanics. 55, 9, p. 1681-1690 10 p.

    Research output: Contribution to journal › Article › Research › peer-review

  8. Published

    In Situ TEM Microcompression of Single and Bicrystalline Samples: Insights and Limitations

    Imrich, P. J., Kirchlechner, C., Kiener, D. & Dehm, G., 19 May 2015, In: JOM. 67, 8, p. 1704 1712 p.

    Research output: Contribution to journal › Article › Research › peer-review

  9. Published

    Fracture mechanics of thin film systems on the sub-micron scale

    Kozic, D., Treml, R., Schongrundner, R., Brunner, R., Kiener, D., Zechner, J., Antretter, T. & Ganser, H. P., 6 May 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 7103088

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  10. Published

    Microstructure and mechanical properties of CuxNb1- x alloys prepared by ball milling and high pressure torsion compacting

    Abad, M. D., Parker, S., Kiener, D., Primorac, M. M. & Hosemann, P., 5 May 2015, In: Journal of alloys and compounds. 630, p. 117-125 9 p.

    Research output: Contribution to journal › Article › Research › peer-review

  11. Published

    Internal and external stresses: In situ TEM compression of Cu bicrystals containing a twin boundary

    Imrich, P. J., Kirchlechner, C., Kiener, D. & Dehm, G., 15 Apr 2015, In: Scripta materialia. 100, p. 94-97 4 p.

    Research output: Contribution to journal › Article › Research › peer-review

  12. Published

    Influence of Microstructure on the Deformation Behaviour of Chromium

    Fritz, R., Wimler, D., Krautgasser, C., Leitner, A., Maier, V. & Kiener, D., 9 Apr 2015.

    Research output: Contribution to conference › Poster › Research

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