In situ micromechanical compression experiments in a transmission electron microscope enable the study and analysis of small-scale deformation behavior. The implementation of instrumented indenter systems allows measuring the force and displacement, providing additionally insights on sample strength and flow behavior. Using focused ion beam sample preparation, single- and bicrystalline specimens can be fabricated to study the influence of individual grain boundaries on the mechanical behavior. Taperless single crystalline and bicrystalline Cu compression pillars including a coherent twin boundary were deformed in scanning and conventional transmission electron microscopy mode to study the applicability of both techniques for examining dislocation dynamics and interaction with the boundary. Based on experimental results, possibilities and limitations of such experiments are critically discussed, including sample preparation, in situ annealing to remove ion beam-induced defects, imaging of dislocations, and acquisition of stress–strain data. Finally, an outlook is given on the potential of micromechanical in situ transmission electron microscopic experiments for analyzing the influence of grain boundaries on mechanical behavior.